Multi-layer ceramic electronic component

A technology of multilayer ceramics and electronic components, applied in the direction of electrical components, laminated capacitors, fixed capacitor parts, etc., can solve the problems of product quality reduction, moisture resistance and reliability reduction, etc.

Active Publication Date: 2021-03-05
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the above properties, when a plating layer is formed on the outside of the external electrode, the plating solution can easily penetrate into it, which may mainly lead to a decrease in product quality due to a decrease in moisture resistance reliability

Method used

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  • Multi-layer ceramic electronic component
  • Multi-layer ceramic electronic component
  • Multi-layer ceramic electronic component

Examples

Experimental program
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Embodiment Construction

[0023] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0024] This disclosure may, however, be illustrated in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0025] Throughout the specification, it will be understood that when an element such as a layer, region or wafer (substrate) is referred to as being "on", "connected to" or "bonded to" another element When an element is used, the element may be directly "on" the other element, directly "connected to" the other element, or directly "coupled" to the other element, or there may be an intervening element therebetween. other components. In contrast, when an element is referred to as being "directly on," "directly conne...

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PUM

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Abstract

The invention provides a multilayer ceramic electronic component. The multilayer ceramic electronic component includes a ceramic body, and a first external electrode and a second external electrode respectively provided on a surface of the ceramic body. The ceramic body includes: a capacitance forming portion including a dielectric layer and an inner electrode; edge portions provided on both sidesof the capacitance forming portion; and cover portions provided on both sides of the capacitance forming portion. Wherein the first external electrode comprises a first basic electrode, a first conductive layer and a first terminal electrode, the second external electrode comprises a second basic electrode, a second conductive layer and a second terminal electrode, the first conductive layer is arranged on the edge of the first basic electrode, and the second conductive layer is arranged on the edge of the second basic electrode. The first terminal electrode covers the first base electrode, and the second terminal electrode covers the second base electrode.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0108008 filed with the Korean Intellectual Property Office on September 2, 2019, the entire disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a multilayer ceramic electronic component. Background technique [0003] Recently, with the trend of miniaturization of electronic products, multilayer ceramic electronic components are also required to be miniaturized and have high capacity. [0004] In accordance with the demand for miniaturization and high capacity of multilayer ceramic electronic components, external electrodes of multilayer ceramic electronic components are also becoming thinner. [0005] According to the prior art, in order to form the external electrodes, glass, base resin, and organic solvent are mixed with conventional conductive metals to make external electrode paste, which is applied to both end ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/12H01G4/30
CPCH01G4/302H01G4/1227H01G4/005H01G4/12H01G4/30H01G4/232H01G4/306H01G5/14H01G4/2325
Inventor 郑仁景申东辉
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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