Circuit board chip frame assembling and transferring device and method thereof

A transfer device and frame transfer technology, applied in the direction of assembling printed circuits with electrical components, can solve the problems of unstable assembly and transfer of circuit boards, chip frames, etc., and achieve the effects of improving assembly quality, improving accuracy, and good clamping and positioning.

Inactive Publication Date: 2021-03-12
林佳琳
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problem of unstable assembly and transfer of the existing circuit board chip frame, and to provide a circuit board chip frame assembly and transfer device, which is convenient to carry out through the horizontal transfer electric cylinder of the chip frame and the front and rear transfer electric cylinder of the chip frame. Accurate positioning; the empty tray transfer module facilitates the transfer and unloading of the empty chip frame tray; the chip frame clamping module facilitates stable clamping and transfer of the chip frame

Method used

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  • Circuit board chip frame assembling and transferring device and method thereof
  • Circuit board chip frame assembling and transferring device and method thereof
  • Circuit board chip frame assembling and transferring device and method thereof

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Embodiment Construction

[0029] The specific implementation manner of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0030] Such as figure 1 Shown, a kind of circuit board chip frame is assembled conveying positioning mechanism, and this mechanism comprises frame and its upper chip frame feeding device 21, chip frame transferring device 22 and chip frame positioning device 23; Chip frame feeding device 21 is used for The chip frame is fed; the chip frame transfer device 22 is used to transfer the chip frame to the chip frame positioning device 23, and the chip frame positioning device 23 is used to position the chip frame.

[0031] Such as figure 2 As shown, among the figure are the first chip frame 6, the second chip frame 7, the third chip frame 8 and the fourth chip frame 9 to be processed in the present invention; the cross section of the first chip frame 6 is a hollow rectangle, and the first chip frame One side of the chip frame 6 is p...

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Abstract

The invention belongs to the technical field of circuit board automatic production, and discloses a circuit board chip frame assembling and transferring device and method. The device comprises a firstchip frame transfer support, a second chip frame transferring support, a chip frame horizontal transferring electric cylinder, a chip frame horizontal transferring plate, two empty tray transferringmodules, a chip frame front-back transferring electric cylinder and a chip frame clamping module. A chip frame transfer slide rail is arranged on the second chip frame transferring support, the chip frame horizontal transferring electric cylinder is arranged on the first chip frame transferring support, and the two empty tray transferring modules are arranged at the front side and the rear side ofthe left portion of the chip frame horizontal transferring plate respectively, and the chip frame clamping module is used for grabbing a chip frame. According to the present invention, the chip frametransferring and positioning accuracy is improved, the stability and firmness of the chip frame in the transferring process are improved, and therefore the assembling quality is improved conveniently.

Description

technical field [0001] The invention belongs to the technical field of automatic production of circuit boards, and in particular relates to a circuit board chip frame assembly transfer device and a method thereof. Background technique [0002] In the circuit board production process, it is necessary to install chip frames on the circuit board to facilitate the subsequent installation of chips in their respective chip frames, so that the areas of each chip can be effectively divided and separated, so that each chip can work independently. [0003] Existing circuit board production equipment, such as the Chinese utility model patent application (publication number CN210469919U, announcement date: 20200505), discloses a PCB board assembly mechanism, including a feeding mechanism, a turning mechanism, a shaping mechanism and a feeding mechanism. The board is sent to the turning mechanism, which turns the PCB board over, and the feeding mechanism transports the PCB board from the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30
CPCH05K3/30
Inventor 林佳琳朱梅英
Owner 林佳琳
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