PCB assembly, water segregator, liquid cooling module, liquid cooling system and electronic equipment
A technology of PCB board and water separator, which is applied in the direction of electrical equipment structural parts, electrical components, cooling/ventilation/heating renovation, etc. Separation and other issues
Pending Publication Date: 2021-03-12
TENCENT TECH (SHENZHEN) CO LTD
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Problems solved by technology
[0004] However, limited by the manufacturing process, the positional relationship between the electrical connector and the liquid-cooled plug in the liquid-cooled PCB assembly may not exactly match the positional relationship between the PCB slot and the liquid-cooled socket
In this way, during the insertion process of the PCB board components, there may be deviation between the PCB board and the liquid cooling plate, resulting in loose contact between the heating element and the liquid cooling plate, or even separation, which seriously affects the heat dissipation efficiency
Method used
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[0077] In order to make the purpose, technical solution and advantages of the present application clearer, the implementation manners of the present application will be further described in detail below in conjunction with the accompanying drawings.
[0078] The embodiment of the present application provides a printed circuit board (PCB, Printed Circuit Board) assembly, such as figure 1 As shown, the PCB board assembly includes a PCB board 11 , a bracket 12 , a liquid cooling plate 13 , a water inlet plug 14 and a water outlet plug 15 . The PCB board 11 is fixedly connected with the bracket 12 . The liquid cooling plate 13 is fixedly connected to the PCB board 11 , and the liquid cooling plate 13 is in contact with the heating element of the PCB board 11 , and the liquid cooling plate 13 is flexibly connected to the bracket 12 . Both the water inlet plug 14 and the water outlet plug 15 are fixedly connected to the support 12 , and the axis directions of the water inlet plug 1...
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The invention relates to a PCB assembly, a water segregator, a liquid cooling module, a liquid cooling system and electronic equipment, and belongs to the technical field of heat dissipation. The PCBassembly comprises a PCB, a support, a liquid cooling plate, a water inlet plug and a water outlet plug. And the PCB is fixedly connected with the support. The liquid cooling plate is fixedly connected with the PCB, makes contact with a heating element of the PCB and is flexibly connected with the support. The water inlet plug and the water outlet plug are both fixedly connected with the support,and the axis direction of the water inlet plug and the axis direction of the water outlet plug are both parallel to the insertion direction of the PCB. According to the PCB assembly provided by the embodiment of the invention, the liquid cooling plug is fixed on the support, and the support is flexibly connected with the liquid cooling plate. Thus, when the support moves relative to the PCB, the liquid cooling plate does not move along with the support, but always keeps stable contact with the heating element of the PCB, so that the heat dissipation efficiency of the PCB assembly is relativelyhigh.
Description
technical field [0001] The present application relates to the technical field of heat dissipation, in particular to a PCB board assembly, a water separator, a liquid cooling module, a liquid cooling system and electronic equipment. Background technique [0002] Liquid cooling is a heat dissipation method with better heat dissipation efficiency than air cooling. The key component of liquid cooling and heat dissipation is the liquid cooling plate, which is in contact with the heating element and has a flow channel inside. The heat dissipation principle of the liquid cooling plate is: the cooling water entering from the water inlet of the flow channel of the liquid cooling plate is heated by the heating element, flows out from the water outlet of the flow channel, and flows into the flow channel through the water inlet again after the external temperature is cooled. In the road, the above process is carried out continuously, and the heat of the heating element is continuously ...
Claims
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IPC IPC(8): H05K7/14H05K7/20
CPCH05K7/14H05K7/20272H05K7/20509
Inventor 许寿标刘超何玉伟王晋
Owner TENCENT TECH (SHENZHEN) CO LTD