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A kind of fluorinated alicyclic structure epoxy resin and preparation method thereof

A technology of epoxy resin and fluorinated fat, applied in the coating and other directions, can solve the problems of unsatisfactory water absorption and dielectric constant, low UV radiation curing activity, difficult and fast microelectronic packaging and other problems, and achieve a short preparation route. , easy operation, mild response effect

Active Publication Date: 2022-06-21
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Epoxy resin refers to a resin containing two or more epoxy groups in its molecule. Due to its good heat resistance, solvent resistance, physical, mechanical and electrical insulation properties, and good adhesion to various materials , Good chemical stability and widely used as adhesives, coatings, resin-based composite materials, widely used in the field of electronic packaging, but its water absorption and dielectric constant are not ideal, the dielectric constant value is 3 to 4, And the usual epoxy resin is bisphenol A type epoxy resin, because UV radiation curing activity is low, and it is difficult to meet the rapid microelectronic packaging field.

Method used

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  • A kind of fluorinated alicyclic structure epoxy resin and preparation method thereof
  • A kind of fluorinated alicyclic structure epoxy resin and preparation method thereof
  • A kind of fluorinated alicyclic structure epoxy resin and preparation method thereof

Examples

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Effect test

Embodiment 1

[0038] A fluorinated alicyclic structure epoxy resin, calculated in parts by weight, its composition and content are as follows:

[0039]

[0040] Wherein, the acrylate monomer is a mixture of methyl acrylate and butyl acrylate in a mass ratio of 2:1.

[0041] The alicyclic epoxy acrylate compound is provided by Jiangsu Taiter Chemical Co., Ltd.;

[0042] Described glycidyl methacrylate is provided by Nanjing Lanbai Chemical Co., Ltd.;

[0043] Described solvent is ethyl acetate;

[0044] The initiator is dibenzoyl peroxide.

[0045] The preparation method of above-mentioned fluorinated alicyclic structure epoxy resin, the steps are as follows:

[0046] The solvent was added to a 500 mL four-necked flask equipped with a stirring paddle, a condenser tube, a dropping funnel, and a thermometer, and the fluorinated acrylate, acrylate monomer, alicyclic epoxy acrylate compound, and methacrylic acid were shrunk. The mixed monomer of glyceride was added dropwise to the four-ne...

Embodiment 2

[0051] A fluorinated alicyclic structure epoxy resin, calculated in parts by weight, its composition and content are as follows:

[0052]

[0053] Wherein, the acrylate monomer is a mixture of methyl acrylate and butyl acrylate in a mass ratio of 5:5.

[0054] The alicyclic epoxy acrylate compound is provided by Jiangsu Taiter Chemical Co., Ltd.;

[0055] Described glycidyl methacrylate is provided by Nanjing Lanbai Chemical Co., Ltd.;

[0056]Described solvent is the mixture of ethyl acetate and butanone by volume 1:1;

[0057] The initiator is azobisisobutyronitrile.

[0058] The preparation method of above-mentioned fluorinated alicyclic structure epoxy resin, the steps are as follows:

[0059] The solvent was added to a 500 mL four-necked flask equipped with a stirring paddle, a condenser tube, a dropping funnel, and a thermometer, and the fluorinated acrylate, acrylate monomer, alicyclic epoxy acrylate compound, and methacrylic acid were shrunk. The mixed monomer o...

Embodiment 3

[0064] A fluorinated alicyclic structure epoxy resin, calculated in parts by weight, its composition and content are as follows:

[0065]

[0066] Wherein, the acrylate monomer is a mixture of methyl acrylate and butyl acrylate in a mass ratio of 5:5.

[0067] The alicyclic epoxy acrylate compound is provided by Jiangsu Taiter Chemical Co., Ltd.;

[0068] Described glycidyl methacrylate is provided by Nanjing Lanbai Chemical Co., Ltd.;

[0069] Described solvent is the mixture of ethyl acetate and butanone by volume 1:1;

[0070] The initiator is azobisisobutyronitrile.

[0071] The preparation method of above-mentioned fluorinated alicyclic structure epoxy resin, the steps are as follows:

[0072] The solvent was added to a 1000mL four-necked flask equipped with a stirring paddle, a condenser tube, a dropping funnel, and a thermometer, and the fluorinated acrylate, acrylate monomer, alicyclic epoxy acrylate compound, and methacrylic acid were shrunk. The mixed monomer ...

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PUM

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Abstract

The invention discloses a fluorinated alicyclic structure epoxy resin and a preparation method thereof. The raw materials of the epoxy resin include acrylate monomer, fluorinated acrylate, alicyclic epoxy acrylate compound, glycidyl methacrylate, initiator and solvent. The preparation method is as follows: mix acrylate monomers, fluorinated acrylates, alicyclic epoxy acrylate compounds, and glycidyl methacrylate, drop them into the solvent, and then raise the temperature to 70-80°C to obtain the mixture; Add the initiator dropwise into the mixture, react under stirring, continue the reaction at elevated temperature, and obtain the fluorinated aliphatic ring structure epoxy resin. The fluorinated alicyclic structure epoxy resin has UV rapid curing ability, and the cured product has a low dielectric constant, and can be widely used in ultra-large scale integrated circuit technology.

Description

technical field [0001] The invention relates to a fluorinated alicyclic structure epoxy resin and a preparation method thereof, and belongs to the technical field of polymer materials. Background technique [0002] The integration of integrated circuit components has been continuously improved, and the feature size has been continuously reduced, especially the line width has been reduced to sub-micron size. The corresponding signal delay and crosstalk between signals have become the bottleneck problems that limit the overall performance of integrated circuits. Resistor-capacitor delay is a metal interconnection. The biggest challenge facing connection reliability. In the traditional process, aluminum is used as metal interconnect and SiO is used 2 The resistance-capacitance interconnection delay brought by the interconnecting metal-dielectric layer is already greater than the gate delay of the signal itself. The parasitic capacitance effect between metal lines can be reduc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F220/32C08F220/14C08F220/18C08F220/22C09D133/14
CPCC08F220/32C09D133/068C08F220/14C08F220/1804C08F220/22C08F220/325
Inventor 高楠张英强王晓瑞
Owner SHANGHAI INST OF TECH