PCB solder mask method, PCB solder mask system and storage medium
A solder mask and area technology, applied in printing, printing plate preparation, electrical components, etc., can solve problems such as difficult control of solder mask methods, influence of PCB solder mask thickness accuracy, etc., and achieve the effect of improving accuracy and efficiency
Active Publication Date: 2021-03-19
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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Problems solved by technology
However, the solder mask method of the related art is difficult to control, which affects the accuracy of the PCB solder mask thickness
Method used
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[0043] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0044]In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc. indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific o...
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Abstract
The invention discloses a PCB solder mask method, a PCB solder mask system and a storage medium. The PCB solder mask method comprises the following steps: calculating a first ink amount according to apre-acquired first area; performing a first screen printing operation on a first region according to the first ink amount; calculating a second ink amount according to a pre-acquired second area; andperforming a second silk-screen operation on the solder resist region of a second region according to the second ink amount, wherein the first area represents the area of the first region, and the second area represents the area of the second region. According to the invention, the first silk-screen operation is carried out on the first region through the first ink amount, and the second silk-screen operation is carried out on the solder resist region through the second ink amount, thereby achieving the control of the solder resist thickness of the PCB, and improving the solder mask precisionand accuracy of the PCB.
Description
technical field [0001] The invention relates to the field of solder resist, in particular to a PCB solder resist method, a PCB solder resist system and a storage medium. Background technique [0002] At present, with the rapid development of the electronics industry, the demand for PCB is increasing. [0003] In related technologies, the solder mask thickness of PCB has a greater impact on the mounting, signal, and withstand voltage performance of end products. Based on this, many customers have put forward strict requirements on the solder mask thickness of PCB. However, the solder resist method in the related art is difficult to control, which affects the accuracy of the PCB solder resist thickness. Contents of the invention [0004] The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the present invention proposes a PCB solder resist method, a PCB solder resist system and a storage medium, which can control ...
Claims
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IPC IPC(8): H05K3/28B41M1/12B41M1/26B41C1/14
CPCH05K3/282B41M1/12B41M1/26B41C1/14
Inventor 许龙龙刘湘龙罗畅
Owner GUANGZHOU FASTPRINT CIRCUIT TECH