Diamond grinding wheel and preparation method thereof

A diamond grinding wheel and diamond technology, applied in bonding grinding wheels, metal processing equipment, manufacturing tools, etc., can solve the problems of low processing efficiency of sapphire thinning, achieve strong holding force, reduce the number of trimming, and not easy to fall off.

Active Publication Date: 2022-04-08
HENAN FULAIGE ULTRAHARD MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of this, it is necessary for the present invention to provide a diamond grinding wheel and a preparation method thereof, so as to solve the problem of low processing efficiency of sapphire thinning

Method used

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  • Diamond grinding wheel and preparation method thereof
  • Diamond grinding wheel and preparation method thereof
  • Diamond grinding wheel and preparation method thereof

Examples

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Embodiment 1

[0035] see figure 1, the present embodiment provides a diamond grinding wheel, which includes a grinding wheel base 1 and a diamond composite sintered block 2 bonded on the grinding wheel base 1, the diamond composite sintered block 2 is mainly composed of composite diamond particles with a particle size of 400#, particle size It is made of 500# pre-alloyed powder Cu65Sn35 and 40# flake graphite evenly mixed and sintered at high temperature. Wherein, the composite diamond particles are mainly composed of diamond particles and wear-resistant metal compounds formed on the surface of the diamond particles, and the wear-resistant metal compounds are composites of titanium carbide, chromium carbide, aluminum carbide and silicon carbide. The concentration of the composite diamond particles is 150%, the mass fraction of the pre-alloyed powder Cu65Sn35 is 50%, and the mass fraction of the graphite is 10%.

[0036] The embodiment of the present invention provides a kind of preparation...

Embodiment 2

[0051] This embodiment provides a diamond grinding wheel, which has basically the same structure as the diamond grinding wheel provided in Embodiment 1. The main difference is that the concentration of the raw material composite diamond particles used in this embodiment is 125%, and the particle size is 800#. The mass fraction of the alloy powder Cu65Sn35 is 60%, and the particle size is 500#, and the mass fraction of the graphite is 7%, and the particle size is 50#.

[0052] The preparation method of the diamond grinding wheel provided in this example is basically the same as the preparation method of the diamond grinding wheel provided in Example 1, the main difference is: the quantitative relationship of each raw material and the sintering process in step "3. Preparation of diamond composite sintered block" parameter. Among them, the specific sintering process involved in the preparation method provided in this embodiment is: after the graphite mold with the premixed materi...

Embodiment 3

[0054] This embodiment provides a diamond grinding wheel, which has basically the same structure as the diamond grinding wheel provided in Embodiment 1. The main difference is that the concentration of the raw material composite diamond particles used in this embodiment is 140%, and the particle size is 3000#. The mass fraction of alloy powder Cu65Sn35 is 55%, and the particle size is 700#, and the mass fraction of the graphite is 5%, and the particle size is 30#.

[0055] The preparation method of the diamond grinding wheel provided in this example is basically the same as the preparation method of the diamond grinding wheel provided in Example 1, the main difference is: the quantitative relationship of each raw material and the sintering process in step "3. Preparation of diamond composite sintered block" parameter. Among them, the specific sintering process involved in the preparation method provided in this embodiment is: after the graphite mold with the premixed material ...

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Abstract

The invention provides a diamond grinding wheel, comprising a grinding wheel base body and a diamond composite sintered block bonded on the grinding wheel base body, the diamond composite sintered block is mainly composed of composite diamond particles, pre-alloyed powder and flake graphite uniformly mixed and sintered at high temperature The composite diamond particles are mainly composed of diamond particles and wear-resistant metal compounds formed on the surface of the diamond particles. The present invention also provides a preparation method of the above-mentioned diamond grinding wheel, comprising the following steps: pretreatment of diamond particles, forming wear-resistant metal compound, preparing diamond composite sintered block and preparing grinding wheel. Therefore, the diamond grinding wheel provided by the present invention has the characteristics of good wear resistance and long service life; the sapphire thinning process can be applied, which can reduce the number of times the sapphire needs to be trimmed during the thinning process, thereby improving the processing efficiency of sapphire thinning.

Description

technical field [0001] The invention belongs to the technical field of application and processing of superhard materials, and in particular relates to a diamond grinding wheel and a preparation method thereof. Background technique [0002] Sapphire is a single crystal of alumina with a unique lattice structure, wear resistance and hardness second only to diamond. It has good light transmission and electrical insulation. It is an ideal substrate material for LEDs and SOS. Since the 1990s, LED lighting has gradually penetrated into human life, and sapphire has been widely used as LED substrate materials. It is estimated that the sapphire market will be about 10.5 billion in 2021. The thinning of the sapphire substrate is an essential process in the LED production process. At present, sapphire is mainly thinned by grinding wheel. Due to the brittleness of sapphire and deep scratches after thinning will affect the subsequent cutting process, sapphire needs to be trimmed during ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D7/06B24D3/10B24D18/00C23C14/06
CPCB24D7/06B24D7/066B24D3/10B24D18/0009B24D18/0072C23C14/0635
Inventor 孔帅斐张敏捷李和鑫
Owner HENAN FULAIGE ULTRAHARD MATERIAL
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