Arithmetic device, detection system, modeling apparatus, arithmetic method, detection method, modeling method, arithmetic program, detection program, and modeling program
A computing device and computing part technology, which can be used in transportation and packaging, manufacturing auxiliary devices, processing and manufacturing, etc., and can solve problems such as bad situations
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no. 1 approach -
[0041] A molding device according to a first embodiment will be described with reference to the drawings. In the following description, a molding apparatus for molding a three-dimensionally shaped object (three-dimensional molded object) using a known powder bed fusion bonding method (PBF) will be described as an example. In addition, powder bed fusion (PBF) is also called selective sintering (SLS). In addition, the modeling device is not limited to the powder bed fusion method (PBF), and other methods such as direct energy deposition method (DED), material injection method, electron beam melting method (EBM), and fusion deposition method (FDM) can also be used for three-dimensional modeling. A device for shaping objects.
[0042] First, refer to figure 1 as well as figure 2 , the configuration of the molding device 1 will be described. figure 1 is a block diagram schematically showing the structure of the modeling apparatus 1, figure 2 It is a figure which schematicall...
no. 2 approach -
[0519] A molding device according to a second embodiment will be described with reference to the drawings. In the following description, the same reference numerals are assigned to the same constituent elements as those of the first embodiment, and differences will be mainly described. Points not particularly described are the same as those of the first embodiment. This embodiment differs from the first embodiment in that the state of the material layer is obtained, and change information for changing the molding condition is generated based on information on the obtained state of the material layer.
[0520] Figure 19 It is a block diagram showing an example of the main part configuration of the molding apparatus 101 of the second embodiment. The molding unit 30 of the molding device 101 of the second embodiment has a modeling optics unit 36 instead of the modeling optics unit 35 of the first embodiment and its modifications, and has the same configuration as the molding...
no. 3 approach -
[0700] A molding device according to a third embodiment will be described with reference to the drawings. In the following description, the same reference numerals are assigned to the same components as those of the first embodiment and the second embodiment, and differences will be mainly described. Points not particularly described are the same as those of the first and second embodiments. In this embodiment, there are: the imaging device included in the molding device of the first embodiment; and the projection unit and the light receiving unit included in the molding device of the second embodiment. Find the state of the detection target area based on the image data acquired by the imaging device, generate change information based on the state of the detection target area, and calculate the state of the material layer based on the image data acquired by the light receiving unit, and generate change based on the state of the material layer information.
[0701] Figure 2...
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