A method of manufacturing a large-scale printed multilayer board

Abstract

The invention discloses a method for manufacturing a large-scale printed multilayer board, which includes the following steps: S1, making materials; S2, cutting materials; S3, making inner-layer circuits, inner-layer core board A (2) and Make the inner circuit on the inner core board B (4); S4, use a punching machine to drill rivet holes A (5) at intervals on the edge of the inner core board A (2), and the inner core board B ( 4) Punch out rivet holes B (6) at intervals on the edge of the edge; S5, cutting process, use the numerical control forming process to remove the shadow part A (1) on the inner core board A (2), and cut the inner core board B (4) The shaded part B (3) on the top is gong off to prepare for the subsequent splicing; S6, making the bare board (7); S7, laminating before lamination; S8, lamination. The invention has the beneficial effects of solving the problem that large-size printed boards cannot be produced due to equipment capacity limitations, and has high processing precision.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for manufacturing a large-scale printed multilayer board. Background technique [0002] With the development of electronic technology, many customers now design super-sized printed boards, such as figure 1 Shown is a schematic diagram of the structure of a large-size printed board. However, during the production process, such a large-sized printed board is usually unable to be processed due to the performance of the production equipment itself, so it is difficult to meet the customer's requirements, resulting in similar orders. The structure cannot be produced, thereby reducing the economic efficiency of the manufacturer. In order to produce such large-size printed boards, it is usually necessary to purchase foreign equipment, but foreign equipment is expensive, and the precision of the processed products is difficult to meet the required requir...

AI Technical Summary

Problems solved by technology

[0002] With the development of electronic technology, many customers now design super-sized printed boards, such as figure 1 Shown is a schematic diagram of the structure of a large-size printed board. However, during the production process, such a large-sized printed board is usually unable to be processed due to the performance of the production equipment itself, so it is difficult to meet the customer's requirements, resulting in similar orders. The structure cannot be produced, thereby reducing the economic efficiency of the producer

In order to produce such large-size printed boards, it is usually necessary to purchase foreign equipment, but foreign equipment is expensive, and the precision of the processed products is difficult to meet the required requirements

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