Probe card

A technology of probe cards and probes, which is applied in the field of probe cards, can solve problems such as low position accuracy of the front end of probes, decreased strength of guide plates for probe cards, wrong measurement of probe cards, etc., and achieve effective aging testing The effect of manufacturing process, realizing narrow spacing, and effective heat dissipation

Pending Publication Date: 2021-04-06
POINT ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, there is a problem that when a plurality of through-holes are formed, the thickness of the partition wall that separates the adjacent through-holes becomes thinner, thereby reducing the strength of the guide plate for the probe card.
[0011] As mentioned above, the silicon material has the following disadvantages: although it is easy to perform the etching process, its mechanical strength is weak
As a result, the position of the through hole is deformed, and the positional accuracy of the tip of the probe is lowered, which may lead to a problem that the probe card 100' performs measurement incorrectly.

Method used

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Embodiment Construction

[0090] The following merely illustrates the principles of the invention. Therefore, although not explicitly described or illustrated in this specification, those skilled in the art can realize the principle of the invention and invent various devices included in the concept and scope of the invention. In addition, it should be understood that all conditional terms and examples listed in this specification are only for clearly understanding the concept of the invention in principle, and are not limited to such specifically listed examples and states.

[0091] The above objects, features, and advantages will be clarified by the following detailed description related to the accompanying drawings, so those skilled in the art to which the invention pertains can easily implement the technical idea of ​​the invention.

[0092] Embodiments described in this specification are described with reference to cross-sectional views and / or perspective views which are ideal illustrations of the...

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Abstract

The present invention relates to a probe card comprising: a first plate; a second plate coupled to a lower portion of the first plate; an upper guide plate provided on the upper surface of the first plate; and a lower guide plate provided to the lower surface of the second plate. At least one of the upper guide plate and the lower guide plate includes an anodic oxide film material, and the area of the upper guide plate and the area of the lower guide plate are smaller than the area of the first plate and the area of the second plate, so that the surfaces of the first plate and the second plate are exposed.

Description

technical field [0001] The present invention relates to a probe card for inspecting a pattern formed on a wafer. Background technique [0002] The electrical characteristic test of a semiconductor element is performed by bringing a semiconductor wafer close to a probe card having a plurality of probes formed on a wiring board, and bringing each probe into contact with a corresponding electrode pad on the semiconductor wafer. After the probes reach the positions where they come into contact with the electrode pads, the semiconductor wafer can be raised further toward the probe card side by a certain height. The process as described above is called overpressurization, and the distance by which the wafer is further raised by a specific height is called overpressurization amount. [0003] Overpressure can be the process of elastically deforming the probe. Even if the height of the electrode pads or the height of the probes varies due to overvoltage, all the probes can be relia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R1/073
CPCG01R31/2886G01R1/07314G01R1/07342G01R1/07357G01R1/07371G01R1/07335G01R1/0491G01R31/2831
Inventor 安范模朴胜浩边圣铉
Owner POINT ENG
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