Flexible circuit board and method for preparing flexible circuit board
A flexible circuit board, flexible technology, applied in the direction of printed circuit, printed circuit components, circuit bendable/stretchable components, etc., can solve the problems of stress concentration, affecting the normal operation of electronic devices, cracking of solder joints, etc.
Active Publication Date: 2022-03-22
INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG
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Problems solved by technology
[0003] However, when the substrate in the existing flexible circuit board is connected to the rigid chip, stress concentration will occur at the connection between the flexible substrate and the rigid chip due to sudden changes in geometric dimensions and material properties.
The mismatch between the substrate and the rigid chip leads to cracking of the solder joint between the two, which affects the normal operation of the electronic device
Method used
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[0050] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present invention, and do not limit the protection scope of the present invention.
[0051] It should be noted that when a component is said to be "mounted on" another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "set on" another component, it may be set directly on the other component or there may be an intervening component at the same time. When a component is said to be "fixed" to another component, it may be directly fixed to the other component or there may be an intervening component at the same time. The terms "vertical," "horizontal," "left...
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The invention relates to a flexible circuit board and a method for preparing the flexible circuit board. The flexible circuit board includes a flexible substrate and a first connection layer, the first connection layer is formed on the chip mounting area of the substrate, and a stress is provided between the first connection layer and the edge of the chip mounting area buffer. On the premise of not increasing the interconnection area, the flexible circuit board improves the stretchability between the first connection layer and the conductive bottom plate by moving the position of the first connection layer inward, that is, the distance between the flexible circuit board and the rigid chip is correspondingly improved. The reliability of the connection between the solder joints, thereby improving the reliability of electronic devices with the flexible circuit board in a bent or stretched state.
Description
technical field [0001] The invention relates to the technical field of electronic devices, in particular to a flexible circuit board and a method for preparing the flexible circuit board. Background technique [0002] Flexible circuit boards are gradually applied to various types of flexible electronic devices to meet the needs of miniaturization and folding of electronic devices. [0003] However, when the substrate in the existing flexible circuit board is connected to the rigid chip, stress concentration will occur at the connection between the flexible substrate and the rigid chip due to sudden changes in geometric dimensions and material properties. The mismatch of the rigidity between the substrate and the rigid chip leads to cracking of the solder joint between the two, which affects the normal operation of the electronic device. Contents of the invention [0004] Based on this, it is necessary to provide an improved flexible circuit board manufacturing method and ...
Claims
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IPC IPC(8): H05K1/02H05K1/11H05K3/40
CPCH05K1/0283H05K1/118H05K3/40
Inventor 付浩然唐瑞涛张柏诚周涛
Owner INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG