Semiconductor refrigeration device

A refrigeration device and semiconductor technology, applied in refrigerators, refrigeration components, refrigeration and liquefaction, etc., can solve the problems of limited cooling effect, lower body temperature, and high cost, so as to improve human comfort, reduce ambient temperature, and improve service life. Effect

Inactive Publication Date: 2021-04-13
合肥卓电科技有限责任公司
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In high temperature weather, in certain small rooms, such as kitchens, bathrooms and other places, in order to adjust the ambient temperature to a suitable temperature, especially when the high temperature environment needs to cool down, ordinary fans have appeared to solve the problem of excessive room temperature. , Cooling fans and air-conditioning equipment that can achieve cooling output: use ordinary fans to blow out natural wind to take away body heat and reduce body temperature. When the temperature is high in summer, the cooling effect is limited; using cooling fans, the combination of fans and water circulation reduces environmental temperature, this solution can achieve a small cooling effect, but the setting of waterways or water storage tanks is relatively cumbersome and cannot achieve a good cooling effect; the installation of air-conditioning equipment that can achieve cooling output is more complicated, the cost is high, and the power consumption Big

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor refrigeration device
  • Semiconductor refrigeration device
  • Semiconductor refrigeration device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] refer to figure 1 , figure 2 As shown, the present invention is a semiconductor refrigeration device, which includes a housing 1 , a refrigeration assembly 2 , a fan assembly 3 , a cooling outlet 4 , an air outlet 5 and a power supply module 6 .

[0031] The bottom of the casing 1 is provided with an air inlet 104 for introducing outdoor fresh air. The air inlet 104 is provided with a plurality of baffles 103 to form several air inlet passages. The baffles 103 are arranged in parallel. A certain angle is formed between them to increase the air intake area.

[0032] refer to image 3 , Figure 4 As shown, the cooling assembly 2 includes a semiconductor cooling sheet 201 with a cold end and a hot end, the cooling assembly 2 is arranged on the inner side wall of the housing 1, and a cooling channel near the cold end and a heat dissipation channel near the hot end are formed in the cooling assembly 2; 2 also includes a cold-end cooling fin group 202 and a hot-end heat ...

Embodiment 2

[0042] refer to figure 1 , figure 2 As shown, the present invention is a semiconductor refrigeration device, which includes a housing 1 , a refrigeration assembly 2 , a fan assembly 3 , a cooling outlet 4 , an air outlet 5 and a power supply module 6 .

[0043] The bottom of the casing 1 is provided with an air inlet 104 for introducing outdoor fresh air. The air inlet 104 is provided with a plurality of baffles 103 to form several air inlet passages. The baffles 103 are arranged in parallel. A certain angle is formed between them to increase the air intake area.

[0044] refer to image 3 , Figure 4 As shown, the cooling assembly 2 includes two semiconductor cooling fins 201 with a cold end and a hot end, the cooling assembly 2 is arranged on the inner side wall of the housing 1, and a cooling channel near the cold end and a heat dissipation channel near the hot end are formed in the cooling assembly 2; The assembly 2 also includes a cold-end cooling fin group 202 and a...

Embodiment 3

[0052] Compared with Embodiments 1 and 2, the difference is that, refer to Figure 6 , Figure 7 As shown, the cold-end cooling fin group 202 is arranged in the cooling channel and is connected with a conduit 204, one end of the conduit 204 is connected to the cold end of the semiconductor cooling chip 201, and the cold-end cooling fin group 202 is equipped with a first fan 205 The hot end cooling fin group 203 is arranged in the heat dissipation passage and connects the hot end of the semiconductor cooling fin 201, the hot end cooling fin group 203 upper surface is provided with a second fan 206, and the cooling capacity of the semiconductor cooling fin 201 cold end passes through the conduit 204 is guided to the hot-end cooling fin set 203, and the cold energy is blown out with the wind by the second fan 206.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a semiconductor refrigeration device and relates to the technical field of refrigeration devices. The semiconductor refrigeration device comprises a shell, a refrigeration assembly, a fan assembly, a heat dissipation opening, an air outlet and a power supply module, wherein an air direction plate is arranged at the bottom of the inner side of the shell; an air adjusting plate for changing the air direction is arranged on the inner side of the shell; an air inlet is formed in the bottom of the shell; the refrigeration assembly comprises at least one semiconductor refrigeration sheet with a cold end and a hot end; the refrigeration assembly is arranged on the inner side wall of the shell; the fan assembly is arranged on the inner side wall of the shell; the heat dissipation opening is formed in the top of the shell; the air outlet is formed in the bottom of the shell; and the power supply module is used for adjusting, controlling and protecting circuits and electrical equipment. According to the semiconductor refrigeration device, refrigeration and ventilation can be switched through switching of an air hole and control of the refrigeration assembly; the appearance size of the semiconductor refrigeration device is equal to or smaller than the height of a suspended ceiling, a user can conveniently embed the refrigeration device on the premise that the original room layout and structure are not changed; the environment temperature can be reduced; and the comfort degree of the human body can be improved.

Description

technical field [0001] The invention belongs to the technical field of refrigeration devices, in particular to a semiconductor refrigeration device. Background technique [0002] In high temperature weather, in certain small rooms, such as kitchens, bathrooms and other places, in order to adjust the ambient temperature to a suitable temperature, especially when the high temperature environment needs to cool down, ordinary fans have appeared to solve the problem of excessive room temperature. , Cooling fans and air-conditioning equipment that can achieve cooling output: use ordinary fans to blow out natural wind to take away body heat and reduce body temperature. When the temperature is high in summer, the cooling effect is limited; using cooling fans, the combination of fans and water circulation reduces environmental temperature, this solution can achieve a small cooling effect, but the setting of waterways or water storage tanks is relatively cumbersome and cannot achieve ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/02F25B49/00
CPCF25B21/02F25B49/00
Inventor 王传路胡延付
Owner 合肥卓电科技有限责任公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products