Thermocompression bonding method and tooling for mems devices with vibration damping function
A thermocompression bonding and device technology, which is applied in the direction of manufacturing tools, auxiliary devices, metal processing equipment, etc., can solve the problems of low manufacturing accuracy and reliability, complicated manufacturing process, etc., and achieve high product reliability, simple manufacturing process, The effect of high precision preparation
Active Publication Date: 2022-05-20
BEIJING AUTOMATION CONTROL EQUIP INST
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[0007] The invention provides a MEMS device thermocompression bonding method and tooling with a vibration damping function, which can solve the problems of complex preparation process, preparation accuracy and reliability of the MEMS low stress patch method with vibration damping function in the prior art low technical issues
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[0030] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0031] It should be noted that the terminology used here is only for describing specific implementations, and is not intended to limit t...
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Abstract
The invention provides a MEMS device thermocompression bonding method and tooling with a vibration damping function, the method comprising: 1) fixing the carrier tape support plate on the tooling bottom plate; 2) placing the carrier tape on the carrier tape support plate 3) Place the carrier tape pressure plate on the carrier tape; 4) Place the carrier tape metal leg pressure plate on the carrier tape pressure plate to shape the metal legs of the carrier tape; 5) Take out the shaped carrier tape; 6) Put the sensor The sensitive structure is fixed on the bottom plate of the tooling; 7) Plant the ball on the sensitive structure of the sensor; 8) Press the gold ball; 9) Align the shaped carrier tape with the gold ball on the top; 10) Perform hot pressing 11) Separate the tooling bottom plate and the carrier tape support plate; 12) Perform visual inspection and electrical inspection on the thermocompression bonded carrier tape and sensor sensitive structural components. The application of the technical solution of the invention can solve the technical problems of complicated preparation process and low preparation precision and reliability in the MEMS low-stress patch method with damping function in the prior art.
Description
technical field [0001] The invention relates to the technical field of MEMS device packaging, in particular to a MEMS device thermocompression bonding method and tooling with a vibration damping function. Background technique [0002] The vibration-damping structure is an indispensable key part of MEMS devices. The existence of vibration-damping structures often leads to complex structures and large volumes of MEMS devices. Therefore, various design methods combining patches and vibration-damping structures have been proposed. The method of attaching MEMS chips to four or more metal support legs is one of the methods with more advantages. It can not only meet the requirements of vibration reduction, but also isolate stress and also have the function of electrical connection. This method not only reduces the volume of the device, but also effectively improves the environmental adaptability such as high and low temperature performance of the device. However, in the prior art,...
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IPC IPC(8): B23K20/02B23K20/24B23K20/26B23K37/04B23P23/00
Inventor 王登顺张菁华王汝弢盛洁苏翼
Owner BEIJING AUTOMATION CONTROL EQUIP INST