Equivalent testing device and method for shearing reliability of SoC packaging interconnection structure

Abstract

The invention discloses an equivalent testing device and method for the shearing reliability of an SoC packaging interconnection structure. The equivalent testing device comprises an equivalent welding assembly, a first tension-compression assembly, a second tension-compression assembly and a tension-compression driver, wherein the equivalent welding assembly comprises an upper-layer metal plate, a lower-layer metal plate and a connecting layer welded between the upper layer metal plate and the lower layer metal plate, and the welding process parameters of the connecting layer are the same as those of a solder layer in the SoC packaging interconnection structure to be tested; an input end of the first tension-compression assembly is connected with an output end of one side of the tension-compression driver, and the output end of the first tension-compression assembly is connected with the upper-layer metal plate; and an input end of the second tension-compression assembly is connected with the output end of the other side of the tension-compression driver, an output end of the second tension-compression assembly is connected with the lower-layer metal plate, and the output direction of the first tension-compression assembly is reversely parallel to the output direction of the second tension-compression assembly. On the basis of accurately testing the shearing reliability of the SoC packaging interconnection structure, the damage to the SoC packaging interconnection structure can be avoided, and meanwhile, the testing cost is reduced.

Description

technical field [0001] The invention relates to the field of chip technology, in particular to an equivalent testing device for shear reliability of an SoC packaging interconnection structure. The invention also relates to an equivalent testing method for the shear reliability of the SoC packaging interconnection structure. Background technique [0002] With the continuous development of the world's high-tech field and the drastic changes in the international environment, the chip industry has received more and more attention in my country, and the importance of independent innovation in the chip field has become increasingly prominent. For a complete chip industry chain, it can be divided into three links according to the sequence: chip design, chip manufacturing, and chip packaging. Among them, chip packaging is a necessary condition for chips to realize preset functions, and constitutes a key link in the chip industry. The so-called chip packaging specifically refers to...

AI Technical Summary

Problems solved by technology

[0006] In the existing technology, in order to ensure the accuracy of the results, the shear reliability test is usually carried out based on the actual SoC package interconnection structure. However, this method of testing will bring permanent damage to the SoC package interconnection structure on the one hand. , on the other hand, special equipment is needed for assistance, and the test cost is relatively high

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