Aerospace device structure three-dimensional thermal deformation measurement method based on finite element analysis

Abstract

The invention discloses an aerospace device structure three-dimensional thermal deformation measurement method based on finite element analysis. The method comprises the steps that a three-dimensional thermal deformation finite element model of an aerospace device structure is established; in a ground simulation environment, multi-point thermal deformation data of a spaceflight device structure and body temperature distribution physical field data of the spaceflight device structure are collected; parameters of the thermal deformation finite element model of the aerospace device structure are corrected by using data acquired in a ground simulation environment and a fitting method, and a mapping relationship between structural thermal deformation and a temperature physical field effect is established; in an on-orbit working state, a thermal deformation finite element model subjected to parameter correction is adopted, physical field data actually measured on orbit of the aerospace device structure is used as model input, and on-orbit three-dimensional thermal deformation data of the aerospace device structure are obtained. The method does not need to be matched with external high-precision geometric quantity measurement equipment in a space state, and can solve the problem of accurate measurement of deformation of large-size complex structural parts under special space environment conditions such as vacuum, weightlessness and high and low temperature.

Description

technical field [0001] The invention relates to a method for measuring thermal deformation, in particular to a method for measuring three-dimensional thermal deformation of an aerospace device structure based on finite element analysis. Background technique [0002] At present, the key structures of spacecraft, such as satellites and space station loads, composite mounting substrates, high-precision antennas, camera brackets, etc., directly determine the reliability and data quality of the entire star. However, in the harsh space environment of high and low temperature, high vacuum, and microgravity, there is a huge difference between the ambient temperature and the ground manufacturing state. Although the structural design of the above-mentioned key structures is complex and the material technology is advanced, thermal deformation of the aerospace device structure is always unavoidable. The life cycle conducts on-orbit observation and adjustment control of structural stabil...

AI Technical Summary

Problems solved by technology

Commonly used model correction methods mainly use ground-measured data correction, which can only correct simplified parameters such as vibration and mode. Obtaining high-precision measurement data can only carry out small-scale single-point observations, and the mutual coupling of physical fields such as force and heat between adjacent structures is still limited. It will cause variation in observation conditions, making the correction accuracy difficult to achieve the ideal state, and can only be used for comparison and reference

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