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A method for making three kinds of copper-thick flexible circuit boards
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A technology of flexible circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, removal of conductive materials by chemical/electrolytic methods, printed circuits, etc., can solve problems such as not being able to meet customer needs, achieve improved circuit production yield, and avoid stage poor problem effect
Active Publication Date: 2022-08-09
龙南骏亚柔性智能科技有限公司
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[0003] With the continuous upgrading and rapid development of products, the existing product structure can no longer meet the needs of customers. After research and repeated tests, a method of manufacturing three kinds of copper thick flexible circuit boards has been developed to meet the design structure needs of customers. According to The customer's requirements for copper thickness in different areas are realized through the production methods of whole board electroplating, selective electroplating and selective copper reduction.
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Embodiment 1
[0033] A method for making three kinds of copper-thick flexible circuit boards, comprising the following steps:
[0034] S1. Preliminarily cut and cut the substrate of the flexible circuit board;
[0035] S2, drilling the substrate of the flexible circuit board;
[0036] S3, perform whole board electroplating on the substrate of the flexible circuit board, form conductive paths between different layers, and realize the copper thickness of the whole area of the flexible circuit board;
[0037] S4, chemically cleaning the substrate of the flexible circuit board;
[0038] S5, performing the first dry film pressing on the substrate of the flexible circuit board;
[0039] S6, perform the first exposure and development treatment on the substrate of the flexible circuit board;
[0040] S7, chemically etching the substrate of the flexible circuit board;
[0041] S8. Perform stripping treatment on the etched flexible circuit board;
[0042] S9. According to the customer's struct...
Embodiment 2
[0057] see figure 1 , the order of thickness of the three copper thicknesses is B area ≥ A area ≥ C area, the copper thickness of A area is realized by the first treatment of the whole plate electroplating, the copper thickness of B area is realized by the second treatment of selective electroplating, and then The copper thickness of the C area is realized by the third treatment of selective copper reduction, that is, the three copper thickness requirements are finally achieved through the one plus one subtraction manufacturing method, so that the copper thickness of the A area is 35um, and the copper thickness of the B area is 55um. The copper thickness of the A area is 20um. At the same time, by adopting this production method, the batch production of products has been realized, and the structural design requirements of customers have been met.
[0058] The test results of the two embodiments show that the three copper-thickness flexible circuit board manufacturing methods ...
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Abstract
The invention discloses three kinds of copper-thick flexible circuit board manufacturing methods, belonging to the technical field of flexible circuit board manufacturing, comprising the following steps: S1. Preliminarily cutting and cutting the substrate of the flexible circuit board; Drill holes on the substrate of the flexible circuit board; S3, perform whole board electroplating on the substrate of the flexible circuit board, form a conductive path between different layers, and realize the copper thickness of the overall area of the flexible circuit board; Cleaning; S5, performing a first dry film pressing process on the substrate of the flexible circuit board; S6, performing a first exposure and development process on the substrate of the flexible circuit board. The flexible circuit board manufacturing method is realized by the combination of whole board electroplating, selective electroplating and selective copper reduction, which can effectively avoid the step difference problem of the three copper thicknesses, which leads to the phenomenon that the dry film cannot be realized during the circuit manufacturing process. , greatly improving the yield of circuit production.
Description
technical field [0001] The invention belongs to the technical field of flexible circuit board manufacturing, in particular to a manufacturing method of three copper-thick flexible circuit boards. Background technique [0002] At present, the copper thickness of conventional flexible circuit boards in the industry is uniform, that is, only one copper thickness is required for a product; for special products, due to bending requirements, two copper thicknesses will be formed by pattern electroplating to meet product requirements. . [0003] With the continuous upgrading and rapid development of products, the existing product structure can no longer meet the needs of customers. After research and repeated testing, three methods of manufacturing copper-thick flexible circuit boards have been developed to meet the design structure needs of customers. Customers' requirements for copper thickness in different areas are realized through the production methods of whole board electro...
Claims
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