A chemical etching device and method based on vector turbulent flow method

Abstract

The invention relates to a chemical etching device and method based on the vector turbulent flow method. The invention controls the directional vector turbulent flow of the etching liquid in the etching area by adding a deflector, including eddy current, cavitation, kinetic energy laminar flow and kinetic energy micro-flow. Fluid; the biggest characteristic of turbulent flow is that it has fluid diffusivity and energy conduction. Under vector pressure, it can penetrate into micropores and thin lines, and solve the problem that metals in micropores and thin lines cannot be etched due to the effect of etching deep grooves in the prior art. , greatly improving the etching precision; the invention simultaneously solves the problems of pool effect and uneven etching of large-area circuit boards, thereby increasing the yield of good products and reducing production costs.

Description

technical field [0001] Based on fluid mechanics, Reynolds number and Bernoulli principle, the present invention provides a vector turbulent flow chemical etching method capable of etching micropores and thin circuit boards in the field of chemical etching, referred to as direct flow method. Background technique [0002] The focus of the flow method is vector and turbulent flow, both of which are indispensable; the vector means that the etching solution is under directional pressure during the entire etching process, and the flow direction of the etching solution is at an angle to the moving target circuit board. It is not parallel to the target circuit board; the vector can be resolved into horizontal and downward sub-vectors or partial pressures, the pressure in the horizontal direction makes the flow liquid advance, and the downward pressure makes the turbulent flow mainly eddy current, entering micropores and thin lines; Eddy currents are multi-directional, shapeless kine...

AI Technical Summary

Problems solved by technology

[0010] The invention provides a chemical etching device and method based on the vector turbulent flow method, referred to as the flow method; the turbulent flow of the etching liquid is controlled by the deflector, including eddy currents, cavitation, and kinetic energy microfluids, and due to the effect of the deflector Make the fluid speed up and change direction in a certain area, so that the horizontal flow becomes a vector flow; the downward pressure helps to etch micropores and thin lines, and the generation of cavitation must generate local pressure in the fluid Poor, the design of the empty grid area C / D area under the deflector titanium wall will produce cavitation, and the shock wave generated by the collapse of the cavitation will make the etchant penetrate into the micropores and thin lines for etching; the direct flow method has a simple structure and does not need to be expensive Advanced materials and complicated process, so the manufacturing cost is low, it can solve the technical problem that the etching process of microholes and thin lines is too complicated in the prior art, and it can etch the metal in micropores and thin lines without complicated process technical effect

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