Laminating device for circuit boards and automatic stacking equipment
A technology for encapsulating devices and circuit boards, which is applied to printed circuits, printed circuit manufacturing, and secondary processing of printed circuits. Improve stacking efficiency, avoid hard contact, and save labor costs
Active Publication Date: 2021-06-22
SUZHOU VEGA TECH CO LTD
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Problems solved by technology
[0002] In the related art, the glue wrapping device of the circuit board is not highly automated, and the production efficiency is low. It takes a lot of labor to wrap the circuit board, and it cannot be applied to the circuit boards of different specifications.
Method used
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Embodiment Construction
[0047] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0048] Refer below Figure 1-Figure 11 A potting device 100 for a circuit board according to an embodiment of the present invention is described.
[0049] like Figure 1-Figure 11 As shown, the encapsulation device 100 according to the embodiment of the present invention includes: a base 101 , a conveying mechanism 2 , a transplanting and conveying mechanism 3 , a jacking mechanism 4 , an encapsulation mechanism 5 and an encapsulation driving mechanism 6 .
[0050] The conveying mechanism 2 is arranged on the upper surface of the base ...
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The invention provides a glue-covering device for circuit boards and automatic stacking equipment. The glue-covering device for circuit boards includes: a base; a material conveying mechanism, which is arranged on the upper surface of the base for Transporting circuit boards; transplanting and conveying mechanism, used to receive circuit boards, so as to place the circuit boards on the conveying material mechanism; jacking mechanism, the jacking mechanism is movable relative to the conveying material mechanism in the height direction of the rubber wrapping device, and the jacking mechanism is suitable for It is used to support the circuit board to lift or lower the circuit board on the conveying mechanism; the encapsulation mechanism is used to encapsulate the circuit board; the encapsulation drive mechanism is set on the base, and the encapsulation drive mechanism is used for The lagging mechanism is driven to move horizontally on the base. Therefore, through the glue wrapping device of the present application, circuit boards of different specifications can be automatically glued, fixed, transplanted and transported, thereby improving the stacking efficiency of circuit boards, and the device has a high degree of automation, which can greatly save manpower cost.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a rubber covering device for circuit boards and automatic board stacking equipment provided with the rubber covering device for circuit boards. Background technique [0002] In the related art, the glue wrapping device of the circuit board is not highly automated, and the production efficiency is low. It takes a lot of labor to wrap the circuit board, and it cannot be applied to the circuit boards of different specifications. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art. For this reason, an object of the present invention is to propose a kind of encapsulation device that is used for circuit board, and this encapsulation device for circuit board can carry out automatic encapsulation fixing and transplanting to the circuit board of different specifications, thereby can impr...
Claims
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IPC IPC(8): H05K3/28
CPCH05K3/28H05K2203/1377
Inventor 王林辛洪德常远庞士君
Owner SUZHOU VEGA TECH CO LTD