Heat dissipation module, radiator and power equipment

Abstract

The invention discloses a heat dissipation module, a radiator and power equipment. The heat dissipation module comprises a heat dissipation substrate and a fin assembly, wherein the fin assembly comprises heat dissipation fins and a sealing plate, the heat dissipation fins comprise the first heat dissipation fins installed on the heat dissipation base plate and the sealing plate connected to the ends, away from the heat dissipation base plate, of the first heat dissipation fins in a sealed mode, and a heat dissipation air channel is formed among the sealing plate, the first heat dissipation fins and the surface, right opposite to the sealing plate, of the heat dissipation base plate. According to the heat dissipation module provided by the invention, the sealing plates are arranged at the end parts of the first heat dissipation fins, so that the heat dissipation module is provided with the air ducts, gas flows in the heat dissipation air ducts according to a preset path, and accumulation of the gas in the heat dissipation module is reduced, and therefore, the heat dissipation efficiency of the heat dissipation module provided by the invention is improved.

Description

technical field [0001] The invention relates to the technical field of equipment heat dissipation, in particular to a heat dissipation module. The present invention also relates to a radiator comprising the above-mentioned heat dissipation module. The present invention also relates to a power device comprising the above heat sink. Background technique [0002] Heat-generating devices are usually dissipated through a heat-dissipating module with heat-dissipating fins. Usually, the heat-dissipating film block is an air-cooled device. Specifically, the flow direction of the wind is restricted by setting an air duct. [0003] Figure 1 to Figure 4 As shown, the radiator includes a box body and a heat dissipation module installed on the box body. The heat dissipation module includes a heat dissipation substrate 01 , heat dissipation fins 02 and an air guide cover 03 covering the heat dissipation substrate 01 and the heat dissipation fins 02 . A heat dissipation air duct is form...

AI Technical Summary

Problems solved by technology

[0004] However, since both the heat dissipation substrate 01 and the air guide cover 03 are installed on the box body, and the inner side of the air guide cover 03 is in contact with the heat dissipation fins 02, there is a gap due to processing errors, which leads to a gap between the air guide cover 03 and the heat dissipation fins 02. The gas between the end faces cannot be discharged smoothly, which leads to a decrease in the heat dissipation efficiency of the heat dissipation module

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