Semiconductor Process Method
A process method and semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as high product cost, low equipment production capacity, and long automatic pressure control time for film transfer, so as to improve equipment production capacity and reduce The effect of product cost, reduction of process time and automatic pressure control time of film transfer
Active Publication Date: 2022-04-08
CHANGXIN MEMORY TECH INC
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[0004] Based on this, it is necessary to adjust the chamber pressure in the process chamber to be significantly lower than the film transfer pressure at the end of the process in the prior art, resulting in longer process time, longer automatic pressure control time for film transfer, and lower equipment capacity. Low and high product cost and other issues, providing a semiconductor process method
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[0025] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. A preferred embodiment of the application is shown in the drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of this application more thorough and comprehensive.
[0026] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to and integrally integrated with the other element, or there may be an intervening element at the same time. The terms "mounted", "one end", "the other end" and similar expressions are used herein for the purpose of description only.
[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commo...
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The invention relates to a semiconductor processing method; comprising the following steps: adjusting the chamber pressure in the process chamber so that the chamber pressure is adjusted to a preset pressure when the process ends, and the preset pressure is equal to or lower than the sheet transfer pressure and greater than The lowest chamber pressure to achieve the best cleaning effect on the process chamber; the processed wafer is transferred out of the process chamber under the transfer pressure. The above semiconductor process method adjusts the chamber pressure in the process chamber so that the chamber pressure is adjusted to be equal to or slightly lower than the film transfer pressure at the end of the process, which can significantly reduce the process time and the automatic pressure control time of the film transfer, thereby effectively improving equipment productivity. Reduce product cost.
Description
technical field [0001] The invention relates to the technical field of semiconductor device manufacturing, in particular to a semiconductor process method. Background technique [0002] In many existing semiconductor processes (for example, film forming processes, etc.), it is necessary to make the chamber pressure in the process chamber significantly lower than the transfer pressure required for transferring wafers after the process is over, so as to ensure that the process chamber can reach The best cleaning effect, and prevent the particles in the process chamber from being poured back into other clean areas in the equipment when the processed wafer is transferred out of the process chamber. However, due to the need to adjust the chamber pressure in the process chamber to a lower value in the above process method, a longer adjustment time is required, resulting in a longer process time, which affects the production capacity of the equipment and leads to an increase in pro...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/67276
Inventor 刘曦光
Owner CHANGXIN MEMORY TECH INC