Circuit board impedance consistency control technology manufacturing method

A control technology and a manufacturing method are applied in the field of circuit board impedance consistency control technology, which can solve the problem of not fully considering impedance line design consistency, and achieve the effects of improving one-time yield, reducing costs and personnel costs.

Active Publication Date: 2021-05-07
LONGNAN JUNYA ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the current manufacturing method of impedance design shows that the design of impedance strips and impedance lines does not fully consider the consistency of impedance line design in separate designs.

Method used

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  • Circuit board impedance consistency control technology manufacturing method
  • Circuit board impedance consistency control technology manufacturing method
  • Circuit board impedance consistency control technology manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] see figure 1 , a method for manufacturing circuit board impedance consistency control technology, comprising the following steps:

[0030] S1. Prefabricate the internal impedance board and make a batch of internal impedance board samples;

[0031] S2. Slicing the internal impedance plate template, and analyzing the sample data of the sliced ​​sample of the internal impedance plate template;

[0032] S3. Summarize the sample data of the sliced ​​samples to obtain the sliced ​​data, and deduce the dielectric constant DK value of the internal impedance plate from the sliced ​​data;

[0033] S4, using the dielectric constant DK value to extract the impedance line in the graph, and analyze the specific distribution of the impedance line in the graph;

[0034] S5. Transfer to the impedance bar according to the distribution density of the impedance line in the graph;

[0035] S6. According to the dielectric constant DK value of the internal impedance plate, the distribution...

Embodiment 2

[0046] see figure 2 , in the current manufacturing method of impedance design, when designing impedance strips and impedance lines, the design of impedance strips and impedance lines shows that the design consistency of impedance lines is not fully considered in separate design, so that the amount of line width bite is large when the impedance strip design line is etched to the copper space, resulting in impedance strips. The measured resistance value is too large, so we adopt the manufacturing method described in Example 1, including the following steps:

[0047] S1. Prefabricate the internal impedance board and make a batch of internal impedance board samples;

[0048] S2. Slicing the internal impedance plate template, and analyzing the sample data of the sliced ​​sample of the internal impedance plate template;

[0049] S3. Summarize the sample data of the sliced ​​samples to obtain the sliced ​​data, and deduce the dielectric constant DK value of the internal impedance p...

Embodiment 3

[0064] see image 3 , in the current manufacturing method of impedance design, when designing impedance strips and impedance lines, the design consistency of the impedance line is not fully considered in the separate design. When the inner line to the copper design is intensively etched, the line width is normal and the resistance value is qualified. The design of the internal impedance line and the impedance line of the impedance strip lacks consistency. Therefore, we adopt the manufacturing method described in Embodiment 1, including the following steps: S1. Prefabricate the internal impedance plate and make a batch of internal impedance plate samples;

[0065] S2. Slicing the internal impedance plate template, and analyzing the sample data of the sliced ​​sample of the internal impedance plate template;

[0066] S3. Summarize the sample data of the sliced ​​samples to obtain the sliced ​​data, and deduce the dielectric constant DK value of the internal impedance plate from ...

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Abstract

The invention discloses a circuit board impedance consistency control technology manufacturing method, and belongs to the technical field of circuit board design and manufacturing. The method comprises the steps of S1 carrying out the pre-manufacturing of an internal impedance board; S2 slicing the internal impedance plate sample plate; S3 summarizing the sample data of the slice samples to obtain slice data; S4 extracting impedance lines in a graph by using the dielectric constant DK value; S5 transferring to impedance strips according to the distribution density of the impedance lines in the graph; S6 keeping the distribution density of the impedance lines of the impedance strips and the impedance lines in the graph synchronous; S7 manufacturing the impedance of a circuit board by adopting the steps; S8 measuring the impedance of the designed circuit board; and S9 designing and manufacturing the impedance consistency of the circuit board. The traditional production design thought is transformed, the impedance line distribution in the board is taken as reference, the impedance strips are synchronously and densely designed when the distribution is dense, and the impedance strips are open when the impedance lines in the board are open, so that the design specification of consistency between the impedance lines in the board and the impedance strips is realized.

Description

technical field [0001] The invention belongs to the technical field of circuit board design and production, and specifically relates to a production method of circuit board impedance consistency control technology. Background technique [0002] With the development of PCB technology and the development of multi-functionality, the use of impedance types is becoming more and more extensive. In the field of electronic communication and aviation, impedance signals directly affect transmission and reception. Impedance consistency in engineering design is the lifeblood of products, and Factors that affect impedance are controlled by dielectric layer thickness, dielectric constant (DK), line width and line spacing, and ink thickness, while engineering design is to optimize the factors that affect impedance to create impedance. [0003] In the prior art, the current manufacturing method of impedance design, when designing the impedance strips and impedance lines, shows that the sepa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0011
Inventor 黎文涛姚红清秦运杰姚奕鸣
Owner LONGNAN JUNYA ELECTRONICS TECH CO LTD
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