Flip vacuum wafer film pasting device

Abstract

The invention relates to a flip vacuum wafer film pasting device, which comprises an upper vacuum cavity (1) and a lower vacuum cavity (2), the upper vacuum cavity (1) and the lower vacuum cavity (2) are respectively and independently connected with vacuum suction equipment, an adsorption structure for adsorbing a circuit board surface of a wafer (3) is arranged in the upper vacuum cavity (1), and a thin film for film pasting is tensioned through a tensioning structure. A supporting structure is arranged in the lower vacuum cavity (2), the tensioning structure is fixed to the supporting structure, a driving structure used for driving the supporting structure to move up and down is arranged below a supporting table in the lower vacuum cavity (2), and after the tensioning structure is installed in place, the lower surface of a film on the tensioning structure is communicated with a cavity body of the lower vacuum cavity (2). And meanwhile, the upper vacuum cavity (1) and the lower vacuum cavity (2) are isolated by the supporting structure and the tensioning structure. Compared with the prior art, flip vacuum wafer film pasting device has the advantages that the risk that the wafer is turned over by 180 degrees for the second time is avoided, and the film is free of bubbles.

Description

technical field [0001] The invention relates to a wafer sticking device, in particular to a flip-chip vacuum wafer sticking device. Background technique [0002] In the wafer manufacturing process, it is often necessary to paste a thin film on the non-circuit board surface (back side) of the wafer. The existing film attachment method is: place the wafer circuit board (front side) down, cover the upper surface (ie back side) of the wafer with a film, and then use rollers to roll the film to achieve film attachment. [0003] This method has the following disadvantages: [0004] 1. In the fully automatic production line, when the wafer is input, the circuit board is facing up in the wafer blue, and the circuit board is also required to face up after the film is pasted. Therefore, in the whole process of film pasting, the wafer needs to go through at least 2 times There is a risk of falling during the flipping process, and the safety of the wafer is reduced; [0005] 2. When ...

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Problems solved by technology

[0004] 1. In the fully automatic production line, when the wafer is input, the circuit board is facing up in the wafer blue, and the circuit board is also required to face up after the film is pasted. Therefore, in the whole process of film pasting, the wafer needs to go through at least 2 times There is a risk of falling during the flipping process, and the safety of the wafer is reduced;

[0005] 2. When the film is pressed by the roller, the wafer is forced downward, and the film is attached to the upper surface, so it is easy to form an air cavity between the wafer and the film. After the film is pasted, the gas will be sealed between the wafer and the film. Between the films, air bubbles are formed; in addition, there is a risk of crushing the wafer by rolling the film with a roller

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