Grinding disc loss algorithm based on silicon wafer grinding equipment

Abstract

The invention provides a grinding disc loss algorithm based on silicon wafer grinding equipment. The grinding disc loss algorithm comprises the following steps: S1, establishing a wandering star disc motion mathematical model; s2, establishing a polar coordinate equation, and calculating and obtaining a motion trail formula of the silicon wafer; and substituting parameters, and drawing a motion trail diagram of one point in the wandering star plate; and S3, deriving the time t by the polar coordinate equation, performing vector accumulation on the tangential direction speed, the normal direction speed and the speed of the upper millstone, and analyzing and obtaining the wear conditions of the silicon wafer in different intervals of the upper millstone. The method has the beneficial effects that the movement condition of the wandering star disc can be analyzed, that is, the loss trend of the grinding disc is analyzed under the condition of different parameters, and according to the analysis, the loss of the grinding disc can be adjusted to be opposite to the condition of the last time in the later equipment use process, so that the utilization rate of the grinding disc can be improved, the grinding disc is fully utilized, the service life is prolonged, and the cost is saved.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, in particular to a grinding disc loss algorithm based on silicon wafer grinding equipment. Background technique [0002] In the existing silicon wafer preparation process, the silicon wafer grinding equipment is composed of sun gear, outer gear, upper plate, lower plate, and planetary plate. The silicon chip is embedded in the planetary disc, and the planetary disc will move on the lower disc with the rotation of the sun gear and the outer gear. The working principle of the grinding equipment is: the planetary plate is placed on the lower plate, and meshes with the outer gear and the sun gear, and the upper plate is covered for grinding. When grinding, the sun gear, outer gear, upper disc and lower disc are all controlled by independent speed-regulating motors. Different speeds can be set to achieve the effect of silicon wafer grinding. [0003] However, since this equipment only has...

AI Technical Summary

Problems solved by technology

This has resulted in insufficient utilization of the grinding disc, and the utilization efficiency is not high

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