Electrostatic chuck device and degumming machine

An electrostatic chuck and placement surface technology, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve the problems of small edge adsorption force and large electrostatic chuck adsorption force, etc.

Active Publication Date: 2021-05-14
宁波润华全芯微电子设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Therefore, the embodiment of the present invention provides an electrostatic chuck device, which solves the problem that the middle adsorption force of the electrostatic chuck is large and the edge adsorption force is small

Method used

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  • Electrostatic chuck device and degumming machine
  • Electrostatic chuck device and degumming machine
  • Electrostatic chuck device and degumming machine

Examples

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Effect test

no. 1 example

[0037] see figure 1 , which is a schematic structural view of the electrostatic chuck device 100 provided in the first embodiment of the present invention, including: an electrostatic chuck 110 . combine figure 2 , the electrostatic chuck 110 is provided with a placement surface, and a plurality of circumferential air passages 120 , a plurality of radial air passages 130 and a plurality of return air passages 140 are arranged on the placement surface. Among them, a plurality of circumferential air passages 120 form a concentric multi-layer structure in the radial direction; a plurality of radial air passages 130 communicate with the air hole 111 in the center of the placement surface and the outermost circumferential air passage 120, and communicate with the remaining circumferential air passages. The air passage 120 is blocked; there are multiple return air passages 140 , and each return air passage 140 communicates with all the circumferential air passages 120 between any ...

no. 2 example

[0071] The second embodiment of the present invention provides a glue remover (not shown in the figure), including the electrostatic chuck device 100 provided in the first embodiment. Wherein, the electrostatic chuck device 100 can be used for fixing the wafer during the process of wafer degluing by the degumming machine, for example, installed in the degumming cavity.

[0072] Preferably, the degumming machine is a fully automatic degumming machine or a semi-automatic degumming machine.

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Abstract

The invention discloses an electrostatic chuck device and a degumming machine, and the electrostatic chuck device comprises: an electrostatic chuck, which is provided with a placement surface, wherein the placement surface comprises: a plurality of circumferential air paths which form a concentric multi-layer structure along the radial direction; a plurality of radial air paths, which are communicated with an air hole in the center of the placement surface and the circumferential air path on the outermost layer, and are blocked from the other circumferential air paths; and a plurality of backflow air paths, each of which is communicated with all the circumferential air paths between any two adjacent radial air paths. The problems that the electrostatic chuck is large in middle adsorption force and small in edge adsorption force are solved.

Description

technical field [0001] The invention relates to the field of wafers in the semiconductor industry, in particular to an electrostatic chuck device and a glue remover. Background technique [0002] At present, in the wafer manufacturing process, precise and stable positioning of the wafer is required. Existing wafer fixing devices often use electrostatic chucks to adsorb wafers. The electrostatic chucks use multiple concentric circular gas paths and multiple radial gas paths to connect each of the circular gas paths. After gas is fed into the electrostatic chuck, the central circular gas path is filled with gas first, and the outer circular gas path will have gas flow after it, thus resulting in the gas in the outer circular gas path The flow rate is smaller than that of the circular gas path inside, so that the adsorption force on the outside of the electrostatic chuck is also smaller than that of the center. Contents of the invention [0003] Therefore, the embodiment of...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67126H01L21/6833H01L21/6838
Inventor 王冲傅立超
Owner 宁波润华全芯微电子设备有限公司
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