A device for improving the uniformity of electroplating in a VCP electroplating line

A uniformity and electroplating line technology, which is applied in the field of devices to improve the electroplating uniformity of VCP electroplating lines, can solve the problems of poor uniformity of electroplating effects and waste of edge materials, and achieve uniform and uniform electroplating effects, strengthen the fixing effect, and increase costs.

Active Publication Date: 2021-12-17
广东成功自动化设备有限公司
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Problems solved by technology

[0004] The embodiment of the present invention provides a device for improving the uniformity of the electroplating of the VCP electroplating line, so as to solve the technical problems of the poor uniformity of the electroplating effect and the waste of edge materials in the electroplating process of the circuit board in the prior art

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  • A device for improving the uniformity of electroplating in a VCP electroplating line
  • A device for improving the uniformity of electroplating in a VCP electroplating line
  • A device for improving the uniformity of electroplating in a VCP electroplating line

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Embodiment Construction

[0026] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] The technical solutions provided by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0028] The embodiment of the present invention provides a device for improving the uniformity of VCP electroplating line plating, including a support frame 1, a fixed frame 2, a fixing device 3 a...

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Abstract

The invention discloses a device for improving the electroplating uniformity of a VCP electroplating line, which belongs to the technical field of printed circuit boards and includes a supporting frame, a fixing frame, a fixing device and a releasing device. U-shaped, one side of the top of the fixing frame is fixedly connected to one end of the bottom of the supporting frame, the fixing frame is in the shape of a mouth, the fixing device is arranged on the periphery of the fixing frame, and the releasing device is arranged on the fixing frame, The release device is movably connected with the fixing device, and its function is to use the support frame to drive the fixed frame and the device on the fixed frame to move, drive the circuit board to perform electroplating, and use the fixing device to fix the circuit board to ensure the stability of the circuit board fixation , and strengthen the electroplating effect of each point of the circuit board to ensure the uniformity of the electroplating effect of the circuit board. The release device can be used to switch and release the fixing device to the circuit board to ensure the overall electroplating effect of the circuit board and reduce material waste.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a device for improving the electroplating uniformity of a VCP electroplating line. Background technique [0002] The vertical continuous electric production line (Vertical Conveyor Plating, referred to as VCP) is a full-board (primary) copper plating production line that adopts a spray copper plating process and a vertical continuous conveying device in the production of printed circuit boards (Printed Circuit Board, referred to as PCB). Compared, it occupies a small area and has stable electroplating efficiency; during the electroplating process, the circuit board is clamped on the fixture, and all workpieces are continuously moved from one side of the electroplating tank to the other under the drive of the mobile device, each piece The production conditions of the workpiece are exactly the same. The circuit board moves continuously in the electroplating tank with...

Claims

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Application Information

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IPC IPC(8): C25D17/06C25D17/00
CPCC25D17/06C25D17/007
Inventor 吴昱凯梁飞戴彬乔文举余仁水
Owner 广东成功自动化设备有限公司
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