Multilayer flexible board preparation method for improving interlayer alignment precision

Abstract

The invention discloses a multilayer flexible board preparation method for improving interlayer alignment precision. The method comprises the following steps: manufacturing a substrate, and manufacturing a target pattern on the substrate; stacking and then pressing the substrates with the target position patterns in sequence to obtain a multi-layer flexible plate; and measuring target position values of the target position patterns on each layer of the multi-layer flexible plate, calculating an average value according to the target position values, and performing targeting positioning according to the average value. According to the invention, the target position values of the target position patterns on each layer of the multilayer flexible board are measured after lamination, the average value is calculated according to the target position values, and the average value is used for targeting positioning, so that the deviation degree of each layer can be effectively reduced, the interlayer alignment precision is ensured by optimal positioning, the production efficiency and the production quality of the circuit board are greatly improved, and the problem of product scrapping caused by interlayer offset in the traditional technology is obviously improved.

Description

Technical field[0001]The present invention relates to the technical field of printed circuit boards, and more particularly to the preparation method of multilayer flexible panels in which inter-layer alternative precision is improved.Background technique[0002]The flexible printed circuit board has a thin, bendable, and is widely used in electronic products. In recent years, with the trend of light, thin and miniaturization of IT (information technology) equipment, the line graphics of the flexible printed board are required to develop in more refined direction, so for multi-layer flexible printed circuit boards. The alignment accuracy requires more strict, and the alignment accuracy between multi-layer flexible plates directly affects the qualification rate and productivity of the product. At present, the factors affecting the alignment accuracy between multilayer flexible plates are mainly: the stability of the flexible plate substrate size, the compression laminated alignment accu...

AI Technical Summary

Problems solved by technology

Obviously, this method will cause larger interlayer offsets of other layers (not the middlemost layer), especially for high-rise or super-high-rise flexible boards, such as 5-layer, 7-layer or even higher-layer flexible boards. In other words, as the number of flexible board layers increases, the interlayer offset of the outer layer will become larger and larger, which will directly lead to product scrapping in severe cases

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