Multi-layer flexible board preparation method for improving alignment accuracy between layers

Abstract

The invention discloses a method for preparing a multi-layer flexible board for improving the alignment accuracy between layers, which comprises manufacturing a substrate and making a target pattern on the substrate; laminating a plurality of substrates with the target pattern sequentially and laminating them to obtain Multi-layer flexible board; measure the target position value of each layer of the target position pattern on the multi-layer flexible board, calculate the average value according to the target position value, and use the average value to perform target positioning. The present invention measures the target position value of each layer of the target position pattern on the multi-layer flexible board after lamination, calculates the average value according to the target position value, and uses the average value to perform target positioning, which can effectively reduce the degree of deviation of each layer, The best positioning is used to ensure the alignment accuracy between layers, which greatly improves the production efficiency and quality of circuit boards, and significantly improves the problem of product scrapping caused by layer-to-layer offset in traditional technology.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for preparing a multilayer flexible board that improves alignment precision between layers. Background technique [0002] Flexible printed circuit boards are thin, light and bendable, and are widely used in electronic products. In recent years, with the popular trend of lightness, thinness and miniaturization of IT (information technology) equipment products, the circuit pattern of flexible printed boards is required to develop in a more refined direction. The requirements for alignment accuracy between layers are more stringent, and the alignment accuracy between layers of multi-layer flexible boards directly affects the product qualification rate and production efficiency. At present, the factors that affect the alignment accuracy between layers of multilayer flexible boards mainly include: the stability of the expansion and contraction of the base mate...

AI Technical Summary

Problems solved by technology

Obviously, this method will cause larger interlayer offsets of other layers (not the middlemost layer), especially for high-rise or super-high-rise flexible boards, such as 5-layer, 7-layer or even higher-layer flexible boards. In other words, as the number of flexible board layers increases, the interlayer offset of the outer layer will become larger and larger, which will directly lead to product scrapping in severe cases

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