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Conductive terminal and manufacturing method thereof

A technology of conductive terminals and manufacturing methods, which is applied in the direction of contact manufacturing, circuits, electrical components, etc., can solve the problems that cannot be solved due to the influence of cracks on the terminal plating layer, and achieve the effect of improving the cracks on the outer surface of the guide area

Pending Publication Date: 2021-06-01
FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this application cannot solve the effect of bending and forming on cracks in the terminal plating

Method used

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  • Conductive terminal and manufacturing method thereof
  • Conductive terminal and manufacturing method thereof
  • Conductive terminal and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment Construction

[0039] Please refer to Figure 1 to Figure 7 As shown, a conductive terminal 1000 is mainly used for vehicle wiring harness connectors (not shown). Cracks are prone to appear at the bends after the second bend, especially the cracks at the frame mouth (guide area 10) are serious. The improvement of the present invention is that: the electroplating of copper includes segmental immersion plating and oblique immersion plating, so that the thickness of the nickel layer in the lead area 10 of the conductive terminal 1000 is smaller than the thickness of the nickel layer in other parts. When folding to form a conductive terminal, the phenomenon of cracks on the outer surface 10a of the guiding area is improved, especially at the corner of the bending. ginseng Figure 6-7 As shown, the actual manufacturing method of the conductive terminal 1000 includes the following steps:

[0040] Step (1): provide the copper sheet 200 (refer to Figure 6 ), the copper sheet has opposite fronts...

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Abstract

The invention relates to a conductive terminal and a manufacturing method thereof. The conductive terminal is formed by electroplating and stamping a copper material, and the surface of the conductive terminal is provided with a nickel layer; the conductive terminal comprises a cylindrical area and a wire clamping area located behind the cylindrical area, the cylindrical area is provided with an inner side and an outer side which are opposite, the cylindrical area is sequentially provided with a guiding area, a contact area and a positioning area from front to back, the inner side of the contact area is provided with a contact point, and the guiding area and the contact area are only locally connected; and the thickness of the nickel layer on the outer side surface of the guide area is smaller than that of the nickel layer on other parts of the conductive terminal. According to the conductive terminal, the electroplating modes of segmented immersion plating and inclined immersion plating are adopted so that the thickness of the nickel layer of the guide area of the conductive terminal is smaller than that of the nickel layer of other parts, and therefore, when the copper sheet of the plane structure is bent to form the conductive terminal, a phenomenon that the surface of the outer side of the guide area is cracked is effectively improved.

Description

【Technical field】 [0001] The invention relates to a conductive terminal and a manufacturing method thereof, in particular to a conductive terminal for improving surface cracks. 【Background technique】 [0002] Crimp terminals are the main terminal structure used in automotive wiring harness connectors. With the development of the market, the main performance requirements for this section of signal transmission are getting higher and higher, especially the requirements for its environmental resistance and reliability. The plating at the contact position At present, there are mainly three conditions: pre-nickel plating / nickel-based tin plating / nickel-based gold plating. Because of the stability and high conductivity of the gold plating layer, it is more popular in the market, but the surrounding structural characteristics of the crimp terminal cause the inside of the terminal The electroplating solution cannot reach the problem of insufficient film thickness. At present, secon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/03H01R43/16
CPCH01R13/035H01R43/16
Inventor 王新利李志科卞道振
Owner FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO LTD
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