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Low-silver lead-free solder paste soldering flux with high ductility

A silver lead-free solder paste, ductility technology, applied in the direction of welding/cutting media/materials, welding media, manufacturing tools, etc., can solve problems such as solder instability, improve stability, improve cracking, anti-corrosion and The effect of improving high temperature resistance

Active Publication Date: 2015-07-22
YIK SHING TAT INDUSTRIALCO LTD
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  • Abstract
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Problems solved by technology

[0003] The invention provides a high-temperature solder with rare earth metal added, which solves the technical problem of solder instability in the high-temperature state in the prior art

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  • Low-silver lead-free solder paste soldering flux with high ductility

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Embodiment Construction

[0009] Specific embodiments of the present invention are described in detail below.

[0010] This high-ductility, low-silver, lead-free solder paste contains tin, 0.3 percent silver and 0.7 percent copper as the main component of the solder, which also includes scandium, tantalum and ruthenium. The inventor has been engaged in solder research for many years, and found in many years of production practice that during the soldering process of circuit boards, the low-silver lead-free solder paste solder is not very hot, and the strength is seriously insufficient, and the solder will open. and cracking phenomenon, although the cracking is very small, it has a very large impact on product quality. The inventors have made statistics and found that the quality problems caused by open welding and cracking account for about 60% of welding quality problems. Therefore, improving the ductility of solder becomes the key to solving the problem. The inventor started with the addition of rar...

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Abstract

The invention discloses a low-silver lead-free solder paste soldering flux with high ductility, the main ingredients of the soldering flux comprise tin, silver, copper, scandium, tantalum and ruthenium, wherein silver accounts for 0.3%, copper accounts for 0.7%, scandium accounts for 1-5%, tantalum accounts for 2-5%, and ruthenium accounts for 2-5%. A rare earth metal adding method is adopted, so the cracking phenomenon is obviously improved, the product stability is increased, and moreover, the corrosion resistance and thermostable performance of the soldering flux are obviously improved.

Description

technical field [0001] The invention relates to soldering materials, in particular to low-silver lead-free tin paste solder used for soldering circuit boards. Background technique [0002] The low-silver lead-free solder paste solder used in circuit board soldering is mainly composed of tin, silver and copper. This solder has certain ductility, but the ductility is not enough, especially under high temperature conditions, the stability of the solder is relatively high. Poor, the strength is also seriously insufficient, it is easy to cause desoldering and cracking. Contents of the invention [0003] The invention provides a high-temperature solder added with rare earth metals, which solves the technical problem of solder instability in the high-temperature state in the prior art. [0004] The main components of the high-temperature solder provided by the present invention to solve the above technical problems include tin, 0.3% silver and 0.7% copper, and the main component...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
Inventor 徐金华吴秋霞马鑫吴建新
Owner YIK SHING TAT INDUSTRIALCO LTD
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