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Heat dissipation framework

A heat dissipation structure and heat pipe technology, which is applied in the construction of electrical equipment components, cooling/ventilation/heating transformation, synthetic resin layered products, etc., can solve the problem of uneven heat dissipation efficiency of heat dissipation module locking pressure, pressure can not be evenly distributed, etc. problems, to achieve the effect of improving heat dissipation efficiency

Active Publication Date: 2021-06-01
SHENXUN COMP KUNSHAN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003]However, in the prior art, when the cooling module is placed against components such as the CPU, it is easy to design screw holes and / or locking points. As a result, the pressure exerted by the heat dissipation module on the electronic components cannot be evenly distributed, resulting in uneven locking pressure of the heat dissipation module and problems in heat dissipation efficiency.

Method used

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Examples

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no. 1 example

[0025] First example, first, see Figure 1 to Figure 4 shown. The first embodiment of the present invention provides a heat dissipation structure U, which includes: an electronic component 1 , a flexible heat conduction film 2 and a heat conductor 3 . For example, the electronic component 1 can be disposed on a carrier P, the flexible heat conduction film 2 can cover the electronic component 1 , and the carrier P can be a circuit board. In addition, according to the first embodiment of the present invention, the electronic component 1 can be a solid-state drive (SSD). In this specific embodiment, the carrier P is a printed circuit board (printed circuit board, PCB), and the substrate 11 of the electronic component 1 is also a printed circuit board. The aforementioned substrate 11 forms a Gold Finger (Gold Finger) or an edge connector (Edge Connector) on one side. The board-to-board connector (not shown) is inserted into the carrier board P. As shown in FIG. However, in othe...

no. 2 example

[0036] Second embodiment, first, see Figure 12 and Figure 13 As shown, the second embodiment of the present invention provides a heat dissipation structure U, which includes: an electronic component 1 , a flexible heat conduction film 2 and a heat conductor 3 . In addition, the electronic component 1 can be arranged on a carrier P, for example, the electronic component 1 can include a substrate 11 arranged on the carrier P and a chip 12 arranged on the substrate 11, and the carrier P and the substrate 11 Can be respectively a circuit board. In addition, preferably, the heat dissipation structure U can further include a heat dissipation structure 4, the heat dissipation structure 4 can be arranged on the carrier board P, the heat dissipation structure 4 can be arranged adjacent to the heat conductor 3, and the heat conductor 3 can be against the electronic component 1 Between the heat dissipation structure 4 and the heat dissipation structure 4 , the heat generated by the e...

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Abstract

The invention discloses a heat dissipation framework which comprises an electronic component, a flexible heat conduction film and a heat conductor, wherein the flexible heat conduction film is arranged on the electronic component, the heat conductor comprises a first part and a second part connected to the first part, and the first part of the heat conductor is clamped in the flexible heat conduction film. According to the heat dissipation framework provided by the invention, the heat dissipation efficiency can be improved through the technical scheme that the flexible heat conduction film is arranged on the electronic element and the first part of the heat conductor is clamped on the flexible heat conduction film.

Description

【Technical field】 [0001] The invention relates to a heat dissipation structure, in particular to a flexible heat dissipation structure. 【Background technique】 [0002] In electronic products, when the system has a higher wattage central processing unit (Central Processing Unit, CPU), chip or solid-state hard disk and other components, it is relatively necessary to configure a heat dissipation module on the device to improve its heat dissipation. efficiency. [0003] However, in the prior art, when the heat dissipation module is placed against components such as the CPU, the pressure exerted by the heat dissipation module on the electronic components cannot be evenly distributed due to the position design of screw holes and / or locking points. , which in turn leads to the problem of uneven locking pressure of the heat dissipation module and the problem of heat dissipation efficiency. [0004] Therefore, how to improve the heat dissipation efficiency of components such as CPU...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/367H01L23/373B32B15/20B32B27/36B32B7/12B32B9/00B32B27/06B32B9/04B32B15/09B32B33/00
CPCH05K7/20454H05K7/20472H05K7/20481H05K7/20445H05K7/20336H05K7/20136H01L23/367H01L23/3735B32B15/20B32B27/36B32B7/12B32B9/007B32B27/06B32B9/045B32B15/09B32B33/00B32B2307/206B32B2307/302
Inventor 吴启荣
Owner SHENXUN COMP KUNSHAN