Adhesive dispensing and packaging device for automobile integrated circuit chip

Abstract

The invention discloses an adhesive dispensing and packaging device for an automobile integrated circuit chip. The adhesive dispensing and packaging device for the automobile integrated circuit chip comprises an installing support, an adhesive dispensing device and a chip position adjusting device, wherein the adhesive dispensing device is installed on the installing support in a sliding manner; the chip position adjusting device is installed on the installing support; the adhesive dispensing device comprises an adhesive dispensing gun and a positioning and packaging structure; the positioning and packaging structure comprises a hard hollow pipe; a pulse valve is installed at one end of the hard hollow pipe and can form gas high-pressure pulses; a square plate is fixedly installed at the other end of the hard hollow pipe through a funnel-shaped structure; and meshes are formed in the square plate. Adhesive dispensing and packaging can be carried out under the condition that the adhesive dispensing gun is not transferred in a large range, so that the adhesive dispensing precision is improved; in addition, the chip position adjusting device can achieve three-dimensional adjustment of the position of a chip; and according to the adhesive dispensing and packaging device for the automobile integrated circuit chip provided by the invention, pulsed high-pressure hot gas is adopted for impact during packaging, so that on one hand, the stress uniformity of a chip shell is improved, on the other hand, uneven stress on the chip and the chip shell can be avoided, the packaging effect is improved, and the chip and the chip shell are protected from being damaged.

Description

technical field [0001] The invention belongs to the technical field of chip processing devices, and in particular relates to an automotive integrated circuit chip dispensing and packaging device. Background technique [0002] With the rapid development of semiconductor technology, more and more chips that can realize different functions are widely used in various fields, and because the chip is a high-precision product, it has a high precision for dispensing when dispensing. Requirements, when dispensing in the prior art, the dispensing is realized by moving the dispensing gun. During the continuous movement of the dispensing gun, it will cause large fluctuations in the liquid level and affect the dispensing accuracy. In addition, the existing In the technology, after the dispensing work is completed, the dispensed chips will be transferred to other devices for packaging. During this process, the glue droplets are prone to deviation, which will also have a negative impact on...

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of semiconductor technology, more and more chips that can realize different functions are widely used in various fields, and because the chip is a high-precision product, it has a high precision for dispensing when dispensing. Requirements, when dispensing in the prior art, the dispensing is realized by moving the dispensing gun. During the continuous movement of the dispensing gun, it will cause large fluctuations in the liquid level and affect the dispensing accuracy. In addition, the existing In the technology, after the dispensing work is completed, the dispensed chips will be transferred to other devices for packaging. During this process, the glue droplets are prone to deviation, which will also have a negative impact on the dispensing results. In order to solve the above problems, The present invention provides the following technical solutions

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