The invention discloses an
adhesive dispensing and packaging device for an automobile
integrated circuit chip. The
adhesive dispensing and packaging device for the automobile
integrated circuit chip comprises an installing support, an
adhesive dispensing device and a
chip position adjusting device, wherein the adhesive dispensing device is installed on the installing support in a sliding manner; the chip position adjusting device is installed on the installing support; the adhesive dispensing device comprises an adhesive dispensing gun and a positioning and packaging structure; the positioning and packaging structure comprises a hard hollow
pipe; a pulse valve is installed at one end of the hard hollow
pipe and can form gas high-pressure pulses; a square plate is fixedly installed at the other end of the hard hollow
pipe through a funnel-shaped structure; and meshes are formed in the square plate.
Adhesive dispensing and packaging can be carried out under the condition that the adhesive dispensing gun is not transferred in a
large range, so that the adhesive dispensing precision is improved; in addition, the chip position adjusting device can achieve three-dimensional adjustment of the position of a chip; and according to the adhesive dispensing and packaging device for the automobile
integrated circuit chip provided by the invention, pulsed high-pressure hot gas is adopted for
impact during packaging, so that on one hand, the stress uniformity of a chip shell is improved, on the other hand, uneven stress on the chip and the chip shell can be avoided, the packaging effect is improved, and the chip and the chip shell are protected from being damaged.