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An automotive integrated circuit chip dispensing packaging device

A technology of integrated circuits and chips, which is applied in the field of automotive integrated circuit chip dispensing and packaging devices, can solve the problems of easy deviation of glue droplets, negative effects on results, and impact on dispensing accuracy, so as to improve packaging effects, protect against damage, Avoid the effect of uneven force

Active Publication Date: 2021-12-21
NINGBO QUNXIN MICRO-ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of semiconductor technology, more and more chips that can realize different functions are widely used in various fields, and because the chip is a high-precision product, it has a high precision for dispensing when dispensing. Requirements, when dispensing in the prior art, the dispensing is realized by moving the dispensing gun. During the continuous movement of the dispensing gun, it will cause large fluctuations in the liquid level and affect the dispensing accuracy. In addition, the existing In the technology, after the dispensing work is completed, the dispensed chips will be transferred to other devices for packaging. During this process, the glue droplets are prone to deviation, which will also have a negative impact on the dispensing results. In order to solve the above problems, The present invention provides the following technical solutions

Method used

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  • An automotive integrated circuit chip dispensing packaging device
  • An automotive integrated circuit chip dispensing packaging device
  • An automotive integrated circuit chip dispensing packaging device

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Embodiment Construction

[0038] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0039] An automotive integrated circuit chip dispensing packaging device, such as Figure 1 to Figure 6As shown, it includes a mounting bracket 1, a dispensing device 2 slidably mounted on the mounting bracket 1, and a chip position adjustment device 3 installed on the mounting bracket 1;

[0040] The mounting bracket 1 includes a mounting base 11, four fixed legs 13 and four movable leg mounts 17 are installed on the bottom of the mounting base 11, the shape and size of the four fixed legs 13 are exactly the same, and the mounting base ...

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Abstract

The invention discloses an automotive integrated circuit chip dispensing packaging device, which includes a mounting bracket, a dispensing device slidingly mounted on the mounting bracket, and a chip position adjustment device mounted on the mounting bracket; wherein the dispensing device includes a dispensing gun and a dispensing device. Positioning packaging structure. The positioning packaging structure includes a hard hollow tube. A pulse valve is installed at one end of the hard hollow tube to form a high-pressure gas pulse. The other end of the hard hollow tube is fixed with a square plate through a funnel-shaped structure. On the square plate With mesh holes, dispensing and packaging can be performed without large-scale transfer of the dispensing gun, thereby improving the dispensing accuracy. In addition, the chip position adjustment device can realize three-dimensional adjustment of the chip position. When packaging in the present invention, Using pulsed high-pressure hot gas impact, on the one hand, it can improve the uniformity of the force on the chip shell, on the other hand, it can avoid the uneven force on the chip and the chip shell, improve the packaging effect, and protect the chip and the chip shell from damage.

Description

technical field [0001] The invention belongs to the technical field of chip processing devices, and in particular relates to an automotive integrated circuit chip dispensing and packaging device. Background technique [0002] With the rapid development of semiconductor technology, more and more chips that can realize different functions are widely used in various fields, and because the chip is a high-precision product, it has a high precision for dispensing when dispensing. Requirements, when dispensing in the prior art, the dispensing is realized by moving the dispensing gun. During the continuous movement of the dispensing gun, it will cause large fluctuations in the liquid level and affect the dispensing accuracy. In addition, the existing In the technology, after the dispensing work is completed, the dispensed chips will be transferred to other devices for packaging. During this process, the glue droplets are prone to deviation, which will also have a negative impact on...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/02B05C13/02H01L21/56H01L21/67
CPCB05C5/027B05C13/02H01L21/6715H01L21/56
Inventor 陈益群陈泓翰顾汉玉
Owner NINGBO QUNXIN MICRO-ELECTRONICS CO LTD
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