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Device for pasting adhesive film on surface of wafer

A technology of adhesive film and equipment, which is applied to the device and coating of the surface coating liquid, which can solve the problem of wafer adhesive film rupture and achieve the effect of ensuring the integrity of the package

Inactive Publication Date: 2021-06-08
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a wafer surface sticking adhesive film equipment to solve the problem of the current wafer surface sticking film equipment in the prior art. film, because the squeeze roller pushes forward with the internal glue in the process of sticking the adhesive film, and sticks the film on the surface of the wafer, which causes rolling and extrusion on the surface of the wafer at the same time, so that the wafer and the stage Pressure generated on the surface, causing cracking problems during the wafer bonding process

Method used

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  • Device for pasting adhesive film on surface of wafer
  • Device for pasting adhesive film on surface of wafer
  • Device for pasting adhesive film on surface of wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] as attached figure 1 to attach Figure 4 Shown:

[0027] Its structure includes an equipment box 1, a shock absorbing support 2, a construction cover 3, a loading tray 4, and a control key 5. The lower end of the equipment box 1 is spirally connected with the shock absorbing support 2. The upper end is hingedly connected, the surface of the equipment box 1 is nested and matched with the loading tray 4, the front end of the loading tray 4 is in clearance with the control key 5, and the construction cover 3 is in clearance with the upper end of the shock absorbing support 2. The equipment case 1 includes a gluer 11, a shock absorber 12, a box body 13, and a construction box 14. The left side of the box body 13 is welded to the side end of the construction box 14, and the construction box 14 is movably matched with both sides of the gluer 11.

[0028] Wherein, the gluer 11 includes a rubber roller 111, a sliding block 112, a roller cover 113, a drive pump 114, a conveyi...

Embodiment 2

[0033] as attached Figure 5 to attach Figure 7 Shown:

[0034]Wherein, the shock absorber 12 includes an upper carrier plate 121, a pressure reducer 122, an anti-break bar 123, a lower support plate 124, and a support seat 125, and the lower end of the upper carrier plate 121 is engaged with the pressure reducer 122. The lower end of the pressure reducer 122 is engaged and connected with the upper end of the lower support plate 124, and the two sides of the lower support plate 124 are fixed with the bolts of the anti-detachment rod 123. The upper end of the seat 125 is nested and connected with the lower support plate 124. The pressure reducer 122 is distributed on the support of the upper carrier plate 121 and the lower support plate 124. The wafer is forced to make shock absorption.

[0035] Wherein, the decompressor 122 includes an air bag b1, a fixed plate b2, a restricting block b3, a sleeve b4, and a shock absorber b5. Both sides of the air bag b1 are engaged with t...

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PUM

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Abstract

The invention discloses a device for pasting an adhesive film on the surface of a wafer. The device structurally comprises a device box, a damping support, a construction cover, a carrying disc and a control button, the lower end of the device box is spirally connected with the damping support, the construction cover is hinged to the upper end of the device box, the surface of the device box is matched with the carrying disc in a nested mode, the front end of the carrying disc is in clearance fit with the control button, the construction cover is in clearance fit with the upper end of the damping support, the device box comprises a glue pasting device, a damping table, a box body and a construction box, and the glue pasting device is movably matched with the surface of the damping table. According to the device, stress buffering is performed on the wafer in the process of pasting the adhesive film through a pressure reducer, the crack of the surface of the wafer due to hard collision is avoided, an air pressure bag deforms towards two sides to buffer a pressing force of the air pressure bag in the pressing process, the air pressure bag is matched with a damper, finally extrusion balls perform support, and the problem that the periphery of the wafer cracks due to the fact that pressure is generated between the wafer and the surface of a carrying table in the process of pasting the adhesive film to the wafer is effectively avoided.

Description

technical field [0001] The invention relates to the field of wafer coating, in particular to an adhesive film sticking equipment on the surface of a wafer. Background technique [0002] The raw material of the wafer is silicon, which is refined through silicon oxide and silicon dioxide, so that various processes are processed to form a silicon wafer. Because its shape is round, it is called a wafer, and it can be processed on a silicon wafer. Form a variety of circuit element structures to form specific electrical functional products; [0003] However, there are the following deficiencies in the prior art: the current equipment for sticking adhesive film on the surface of a wafer needs to stick an adhesive film on the surface, because during the process of sticking the adhesive film, the squeeze roller carries the internal glue forward Pushing and sticking the film on the surface of the wafer, which causes the rolling to form a squeeze on the surface of the wafer, which mak...

Claims

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Application Information

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IPC IPC(8): B05C1/02B05C13/02
CPCB05C1/02B05C13/02
Inventor 梁小明
Owner 梁小明