A 5G communication frequency band pass filter based on LTCC technology

A technology of band-pass filter and communication frequency band, which is applied in the microwave field, can solve problems such as unsatisfactory product performance and complex structure, and achieve the effect of superior electrical performance, small size and high reliability

Active Publication Date: 2022-05-20
NANJING UNIV OF SCI & TECH
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  • Claims
  • Application Information

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Problems solved by technology

[0003] However, at present, the 5G communication frequency band pass filter based on LTCC technology mostly adopts a lumped structure, and there is a problem of complex structure, which makes the performance of the product unsatisfactory. Therefore, it is necessary to design a 5G communication frequency band pass filter with a simpler structure and a distributed structure. filter

Method used

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  • A 5G communication frequency band pass filter based on LTCC technology
  • A 5G communication frequency band pass filter based on LTCC technology
  • A 5G communication frequency band pass filter based on LTCC technology

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Embodiment

[0027] In order to verify the effectiveness of the solution of the present invention, the following simulation experiments are carried out.

[0028] The filter in this embodiment is designed through HFSS three-dimensional modeling and simulation. The 5G communication band pass filter based on LTCC technology has a small volume, only 4.2mm*4.4mm*1.5mm, and the dielectric constant of the ceramic material used is 27. The thickness of the inner metal silver layer is 0.01mm. The key parameter of the model is the size of the inductive resonance line and the capacitive coupling line: the width of the inductive resonance line (SL1, SL2, SL3, SL4, SL5, SL6) is 0.2mm, the first inductive resonance line SL1 and the sixth inductance resonance line The length of SL6 is 3.2mm, the length of the second inductive resonance line SL2 and the fifth inductive resonance line SL5 is 3.25mm, the length of the third inductive resonance line SL3 and the fourth inductive resonance line SL4 is 3.3mm, an...

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Abstract

The invention discloses a 5G communication frequency band pass filter based on LTCC technology. The band pass filter includes a dielectric substrate, a metal isolation layer, a port unit, and a filter circuit unit, wherein the dielectric substrate is a low-temperature sintered ceramic substrate, which has relatively High dielectric constant, the metal isolation layer is composed of the upper and lower layers of the metal silver layer with vacancies dug, the port unit is the metal silver layer covering the surface of the dielectric substrate, including the input end, output end and ground end, the filter circuit unit includes Six resonant circuits and zero-point coupling circuits arranged in parallel. The present invention adopts HFSS three-dimensional integrated design, adopts low-temperature co-fired ceramic technology to realize, and has the advantages of small insertion loss, small volume, light weight, high reliability, good temperature stability, good batch consistency of electrical properties, low cost, and large capacity. Mass production and other advantages.

Description

technical field [0001] The invention relates to the field of microwave technology, in particular to a 5G communication band pass filter based on LTCC technology, which is suitable for 5G communication. Background technique [0002] The function of the filter is to select useful signals and filter out invalid interference signals. It is an important device in the radio frequency system and plays a vital role in the transmitter, relay station and receiver. At present, with the official commercialization of the fifth-generation mobile communication (5G), the number of various terminal equipment and 5G base stations is growing explosively, so it is necessary to develop microwave filter devices with further improved performance, size, reliability and cost. Low-temperature co-fired ceramics (LTCC), as an integrated component technology, has become one of the mainstream technologies of passive integration, and has become the development direction in the field of passive components....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/20
CPCH01P1/20Y02D30/70
Inventor 曾振平胥旺戴永胜
Owner NANJING UNIV OF SCI & TECH
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