A Diffusion Welding Process for the Core Body of a Printed Circuit Board Heat Exchanger
A printed circuit board and diffusion welding technology, which is applied to printed circuits, welding equipment, non-electric welding equipment, etc., can solve problems such as core deformation and joint mechanical performance degradation, and achieve the goals of prolonging service life, improving quality, and reducing deformation Effect
Active Publication Date: 2022-06-21
CHINA UNIV OF PETROLEUM (EAST CHINA)
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Problems solved by technology
Among them, the process parameters of diffusion welding are mutually restricted: the longer the welding time, the higher the welding rate of the joint, but the too long holding time will cause the brittle phase in the joint area, which will lead to the decline of the mechanical properties of the joint; Improve welding quality, but too high pressure can easily cause core deformation
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[0048] It should be noted that the following detailed description is exemplary and intended to provide further explanation of the application. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
[0049] It should be noted that the terminology used herein is for the purpose of describing specific embodiments only, and is not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly dictates otherwise, the singular is intended to include the plural as well, furthermore, it is to be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates that There are features, steps, operations, devices, components, and / or combinations thereof.
[0050] In the present invention, the orientation or positional relationship indicated by terms s...
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The invention discloses a diffusion welding process for the core body of a printed circuit board heat exchanger, which comprises the following steps: ultrasonically cleaning the upper cover plate, the cold side plate, the hot side plate and the lower cover plate forming the core body; Plates, cold side plates, hot side plates, and lower cover plates are stacked up and down to form core laminations; the core laminations are sent to a vacuum diffusion welding furnace for diffusion welding controlled by temperature and pressure coupling; Performance Testing. The diffusion welding process of the printed circuit board heat exchanger core of the present invention improves the quality of the welded joint of the heat exchanger core and reduces the welding process by optimizing the welding temperature, time and pressure during the diffusion welding process. The deformation of the core body prolongs the service life of the heat exchanger.
Description
technical field [0001] The invention belongs to the technical field of printed circuit board type heat exchangers, and in particular relates to a diffusion welding process for a core body of a printed circuit board type heat exchanger. Background technique [0002] Compact and efficient heat exchangers are widely used in petrochemical, aerospace and other fields. In special service environments, such as high temperature gas-cooled reactors, the service temperature of the heat exchanger needs to reach 600°C, the service pressure needs to reach 7MPa, it needs to withstand cyclic thermal stress, and it needs to have high heat transfer performance. At the same time, the structure of the heat exchanger needs to be compact. , these requirements limit the use of compact and high-efficiency heat exchangers in similar harsh conditions. [0003] Diffusion welded printed circuit board heat exchangers have excellent high temperature and high pressure resistance. Therefore, the use of d...
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IPC IPC(8): B23K20/02B23K20/14B23K20/24B23K20/26B23K101/42
CPCB23K20/023B23K20/14B23K20/24B23K20/26B23K2101/42
Inventor 蒋文春王少为石景祯任来超
Owner CHINA UNIV OF PETROLEUM (EAST CHINA)