Method for automatically making impedance test file, electronic equipment and storage medium

Abstract

The invention relates to a method for automatically making an impedance test file. The method comprises the following steps of acquiring the first impedance information, wherein the first impedance information is the impedance information required by a user; acquiring second impedance information, wherein the second impedance information is impedance design image information of the PCB; determining an impedance line type according to a manuscript line distance in the first impedance information; calculating the length of the impedance line according to the impedance line endpoint coordinates in the second impedance information; comparing the length of the impedance line with an impedance line threshold value, and determining coordinates of two target end points; and generating an impedance test file based on the impedance value, the impedance tolerance, the impedance line type and the two target endpoint coordinates. According to the method, automatic selection of the impedance line, calculation of the length of the impedance line and determination of the endpoint and the grounding point of the impedance line can be realized, efficiency of manufacturing the impedance test file is improved, and manufacturing cost is reduced.

Description

technical field [0001] The present application relates to the technical field of impedance testing, in particular to a method for automatically producing impedance testing files. Background technique [0002] In the manufacturing process of PCB printed circuit board (Printed Circuit Board), it is usually necessary to pre-make PCB impedance test files to determine whether the corresponding resistance value meets the requirements set by customers; as the functions of electronic products continue to improve, the impedance of circuit boards The number of lines is also increasing exponentially. For high-speed circuit boards, it is necessary to ensure the continuity of the impedance on the signal transmission path to avoid large reflections of the signal. [0003] In the process of PCB impedance test, the production of the impedance test file in the early stage can only be completed through the combined output of various PCB auxiliary design software (IGI, TDR Surpport, TPG, ERP, ...

AI Technical Summary

Problems solved by technology

[0003] In the process of PCB impedance test, the production of the impedance test file in the early stage can only be completed through the combined output of various PCB auxiliary design software (IGI, TDR Surpport, TPG, ERP, Genesis), etc. Manual operation, the steps are cumbersome and lengthy, the learning is difficult, and the training period is long; as the integration of PCB becomes higher and higher, the level of PCB design is also higher and higher, and the number of impedance groups that need to be controlled is also increasing. , in the manual operation, the production personnel carry out the impedance test file preparation on each layer, which not only consumes a lot of manpower and time, but also has low work efficiency, and it is very easy to have the problems of missed selection, wrong selection, and wrong selection, and it is also difficult to do. to cost control

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