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Preparation method of metal wire structure for high-temperature heating

A technology of high-temperature heating and metal wires, applied in the process of producing decorative surface effects, microstructure technology, microstructure devices, etc., can solve the problems of warping and peeling of the insulating protective layer, easy oxidation of the metal of the insulating protective layer, etc.

Pending Publication Date: 2021-06-15
XIAMEN HIGH END MEMS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] What the present invention aims to solve is the technical problem that the metal is easy to oxidize and the insulating protective layer is warped and peeled off, which is easy to exist in the insulating protective layer under high temperature heating conditions in the prior art

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  • Preparation method of metal wire structure for high-temperature heating
  • Preparation method of metal wire structure for high-temperature heating
  • Preparation method of metal wire structure for high-temperature heating

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Embodiment Construction

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0039] Reference herein to "one embodiment" or "an embodiment" refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present application. In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom" etc. is based on the orientation or positional relationship shown in the drawings, and is only for It ...

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Abstract

The invention relates to the technical field of semiconductors, and discloses a preparation method of a metal wire structure for high-temperature heating. The preparation method comprises the following steps: preparing and forming a metal wire layer on a silicon substrate; preparing an insulating protection layer on the metal wire layer to obtain a to-be-annealed structure; and carrying out annealing treatment on the to-be-annealed structure. The metal wire structure obtained by the preparation method provided by the invention has the characteristics of high-temperature self-heating function and high-temperature resistance.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for preparing a metal wire structure used for high-temperature heating. Background technique [0002] With the rapid development of Micro-Electro-Mechanical System (MEMS) technology, micro-heaters based on MEMS micromachining technology have been favored due to their small size, low power consumption, short response time, and easy integration. Widely used in gas sensing, infrared detection and other fields. [0003] Usually, the high-temperature heating metal wire structure is the core unit of the MEMS micro-heater, which directly determines the overall performance of the device. At present, commonly used heating metals include Pt, Mo, W, etc. Among them, the resistance of Pt will be unstable above 650°C, so the use temperature is limited. To achieve a higher temperature working environment, it is necessary to use Mo or W as the heating metal. Taking Mo as an ex...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
CPCB81C1/00015B81C1/0065B81C2201/0161
Inventor 于海涛
Owner XIAMEN HIGH END MEMS TECH CO LTD