Eutectic device and transistor packaging eutectic system

A transistor and wafer technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of transistor eutectic accuracy and poor welding effect, reduce preheating structure processing and assembly tolerances, and improve eutectic The effect of efficiency

Active Publication Date: 2021-06-15
深圳市东飞凌科技有限公司
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Problems solved by technology

[0004] The purpose of the embodiments of the present invention is to provide a eutectic device to solve the technical problems of transistor eutectic accuracy and poor welding effect in the prior art
[0005] Another purpose of the embodiments of the present invention is to provide a transistor packaging eutectic system to solve the technical problems of transistor eutectic accuracy and poor welding effect existing in the prior art

Method used

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  • Eutectic device and transistor packaging eutectic system
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  • Eutectic device and transistor packaging eutectic system

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Embodiment Construction

[0043] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0044] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the...

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Abstract

The invention provides a eutectic device and a transistor packaging eutectic system. The eutectic device comprises a wafer suction structure, a to-be-eutectic product suction structure, preheating structures, eutectic heating platforms and eutectic recognition structures, the wafer suction structure is used for sucking wafers, the to-be-eutectic product suction structure is used for sucking to-be-eutectic products, the preheating structures are used for preheating the to-be-eutectic products, the eutectic heating platforms are used for heating a wafer and the to-be-eutectic products, the eutectic recognition structures are used for photographing in the eutectic process, the number of the preheating structures, the number of the eutectic heating platforms and the number of the eutectic recognition structures are all two, the two preheating structures are arranged corresponding to the two eutectic heating platforms respectively, and the two eutectic recognition structures are correspondingly arranged above the two eutectic heating platforms. According to the eutectic device, the eutectic efficiency can be improved, the structures of the two preheating structures are the same, the influence of machining and assembly tolerance of the preheating structures is greatly reduced, and the eutectic precision and the eutectic effect of the two eutectic heating platforms are basically consistent.

Description

technical field [0001] The invention belongs to the technical field of transistor packaging, and more specifically relates to a eutectic device and a transistor packaging eutectic system. Background technique [0002] The TO-CAN eutectic system currently used in the optical communication industry uses a heating platform, and the same preheating system is equipped with two or four preheating rotating tubes. Due to the large processing and assembly tolerances of each preheating rotary tube, the eutectic precision and eutectic welding effect between the preheating tubes will be greatly different, which will increase the difficulty of subsequent processes and affect product performance. [0003] The four preheating tubes of the existing TO-CAN eutectic system are distributed on the same rotating system at intervals of 90°, and are assembled on the rotating system by sinking the preheating tubes and fixing the top wire on the side. The suction nozzle puts the product into 1 # T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67121H01L21/67098H01L21/6838
Inventor 胡靖温永阔黄黎明谢少华刘盼
Owner 深圳市东飞凌科技有限公司
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