Eutectic device and transistor package eutectic system

A eutectic system and transistor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of transistor eutectic precision and poor welding effect, reduce preheating structure processing and assembly tolerances, and improve common Effect of Crystal Efficiency

Active Publication Date: 2022-04-01
深圳市东飞凌科技有限公司
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the embodiments of the present invention is to provide a eutectic device to solve the technical problems of transistor eutectic accuracy and poor welding effect in the prior art
[0005] Another purpose of the embodiments of the present invention is to provide a transistor packaging eutectic system to solve the technical problems of transistor eutectic accuracy and poor welding effect existing in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Eutectic device and transistor package eutectic system
  • Eutectic device and transistor package eutectic system
  • Eutectic device and transistor package eutectic system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0043] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0044] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a eutectic device and a transistor packaging eutectic system. The eutectic device includes a wafer suction structure, a product suction structure to be eutectic, a preheating structure, a eutectic heating platform, and a eutectic identification structure. The structure is used to pick up the wafer and the product to be eutectic. The suction structure is used to pick up the product to be eutectic. The preheating structure is used to preheat the product to be eutectic. The identification structure is used to take pictures during the eutectic process. There are two preheating structures, eutectic heating platforms and eutectic identification structures. The two preheating structures are respectively set corresponding to the two eutectic heating platforms. The eutectic recognition structure is correspondingly arranged above the two eutectic heating platforms. The eutectic device can improve eutectic efficiency, and the two preheating structures have the same structure, which greatly reduces the influence of preheating structure processing and assembly tolerances, making the eutectic precision of the two eutectic heating platforms basically consistent with the eutectic effect.

Description

technical field [0001] The invention belongs to the technical field of transistor packaging, and more specifically relates to a eutectic device and a transistor packaging eutectic system. Background technique [0002] The TO-CAN eutectic system currently used in the optical communication industry uses a heating platform, and the same preheating system is equipped with two or four preheating rotating tubes. Due to the large processing and assembly tolerances of each preheating rotary tube, the eutectic precision and eutectic welding effect between the preheating tubes will be greatly different, which will increase the difficulty of subsequent processes and affect product performance. [0003] The four preheating tubes of the existing TO-CAN eutectic system are distributed on the same rotating system at intervals of 90°, and are assembled on the rotating system by sinking the preheating tubes and fixing the top wire on the side. The suction nozzle puts the product into 1 # T...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67121H01L21/67098H01L21/6838
Inventor 胡靖温永阔黄黎明谢少华刘盼
Owner 深圳市东飞凌科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap