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Chip clamp, chip cleaning device and chip etching device

A chip fixture and chip technology, which is applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of the contact area between the chip fixture and the chip affecting the processing quality of the chip, and avoid water marks or uneven etching thickness. The effect of improving the yield rate

Active Publication Date: 2021-06-15
泉芯集成电路制造(济南)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a chip holder, a chip cleaning device and a chip etching device to solve the problem of excessive contact area between the chip holder and the chip in the prior art Technical Issues Affecting Chip Processing Quality

Method used

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  • Chip clamp, chip cleaning device and chip etching device
  • Chip clamp, chip cleaning device and chip etching device
  • Chip clamp, chip cleaning device and chip etching device

Examples

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Embodiment Construction

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without cre...

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Abstract

The invention discloses a chip clamp, a chip cleaning device and a chip etching device, and relates to the technical field of chip manufacturing. The chip clamp comprises a supporting platform and a plurality of chucks arranged on the supporting platform, a chip fixing space is defined by the chucks, the edge of a chip makes contact with the side walls of the chucks at the same time so that the chip can be fixed in the fixing space, and a gap exists between the chip and the supporting platform. And the chip is jointly clamped in the fixed space by the side walls of the plurality of chucks, and a certain distance exists between the chip and the supporting platform below the chip. The side walls of the chucks are only in contact with the edge of the chip, and meanwhile, a gap is formed between the back surface of the chip and the supporting platform, so that the back surface of the chip is completely exposed and is not in contact with other objects. When the chip clamp is used for cleaning or micro-etching the back surface of the chip, the phenomenon that the back surface of the chip is covered to generate water marks or the etching thickness is not uniform is effectively avoided, and the yield of the chip is improved.

Description

technical field [0001] The invention relates to the technical field of chip manufacturing, in particular to a chip fixture, a chip cleaning device and a chip etching device. Background technique [0002] In the single crystal process, the chip is transferred one by one on the machine. During the whole process, the chip needs to be subjected to repeated high-temperature film growth and etching. The back of the chip needs to be cleaned and micro-etched due to too many process passes. etch to remove impurities and back thickness on the chip surface. [0003] At present, during chip cleaning and micro-etching, a flat chuck is usually used to pick up the chip and position the chip. However, the contact area between the flat chuck and the chip is relatively large, which may easily cause the liquid to fail to be discharged smoothly during the process. There are water marks on the back edge of the chip, which affects the quality of the chip. Contents of the invention [0004] Th...

Claims

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Application Information

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IPC IPC(8): H01L21/687H01L21/67
CPCH01L21/687H01L21/6704H01L21/67075
Inventor 王东铭许忠晖陈嘉勇
Owner 泉芯集成电路制造(济南)有限公司