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Phase change memory and manufacturing method thereof

A phase change memory and phase change storage technology, applied in the field of semiconductors, can solve the problems of long duration of phase transition of the phase change memory layer, limiting the writing speed of phase change memory, etc., to reduce power consumption and duration , Improve the effect of writing speed

Inactive Publication Date: 2021-06-15
YANGTZE ADVANCED MEMORY INDUSTRIAL INNOVATION CENTER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This invention relates to an improved method for controlling how fast it changes from one state (crystal) into another without consuming too much energy or causing damage during writing data on a device with this technology.

Problems solved by technology

The technical problem addressed in this patented method relates to improving the performance of phase changes memories during their use on electronic systems such as smartphones or tablets with limited battery capacity.

Method used

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  • Phase change memory and manufacturing method thereof
  • Phase change memory and manufacturing method thereof
  • Phase change memory and manufacturing method thereof

Examples

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example 1

[0125] Figure 5a to Figure 5j It is a manufacturing method of a phase change memory shown according to an exemplary embodiment. refer to Figure 5a to Figure 5j , the method includes the following steps:

[0126] Step 1: Refer to Figure 5a As shown, the first conductive material layer 1110 and the storage stack structure are formed on the surface of the substrate 1001, and the first mask layer 1261 covering the storage stack structure is formed; wherein, the storage stack structure includes: the first An electrode material layer 1211a, a gate material layer 1221, a first induction material layer 1231, a phase change storage material layer 1241 and a second electrode material layer 1211b; the first induction material layer 1231 is used to induce a phase change storage material layer 1241 Transition from amorphous to crystalline phase.

[0127] The constituent material of the first conductive material layer 1110 includes a conductive material. Conductive materials include...

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Abstract

An embodiment of the invention discloses a phase change memory and a manufacturing method thereof. The phase change memory comprises a first conductive wire, a phase change memory unit and a second conductive wire which are sequentially stacked from bottom to top, wherein the first conductive wire and the second conductive wire are parallel to the same plane and are perpendicular to each other, and the phase change memory unit is perpendicular to the first conductive wire and the second conductive wire; the phase change memory unit comprises a first induction layer and a phase change storage layer which are arranged in a stacked mode; and the first induction layer is located between the phase change memory layer and the first conductive wire and is used for inducing the phase change memory layer to be converted from an amorphous phase to a crystalline phase.

Description

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Claims

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Application Information

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Owner YANGTZE ADVANCED MEMORY INDUSTRIAL INNOVATION CENTER CO LTD
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