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A self-adaptive floating suction head that can be aligned with high precision

An adaptive and high-precision technology, applied in manufacturing tools, workpiece clamping devices, etc., can solve problems such as difficulty in meeting the testing requirements of tiny chips and high-density pins, and achieve strong adaptive compatibility, high precision, and improved efficiency. Effect

Active Publication Date: 2021-09-07
天津金海通半导体设备股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention aims to propose a high-precision alignment and follow-up adaptive floating suction head to solve the problem that the existing packaging and testing equipment is difficult to meet the testing requirements of tiny chips and high-density pins

Method used

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  • A self-adaptive floating suction head that can be aligned with high precision
  • A self-adaptive floating suction head that can be aligned with high precision
  • A self-adaptive floating suction head that can be aligned with high precision

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Embodiment Construction

[0031] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0032] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner" and "outer" are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and Simplified descriptions, rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and thus should not be construed as limiting the invention. In addition, the terms "first", "second", etc. are used for descriptive purposes only, and should not be understood ...

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PUM

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Abstract

The invention provides a high-precision alignment and follow-up self-adaptive floating suction head. The upper end of the fixed block is located inside the pressure-bearing block, and the pressure-bearing block and the fixed block move relative to each other. The pressure-bearing block is located between the fixed block and the external equipment. The middle part of the air circuit block is provided with the first installation hole. The lower end of the fixed block is located in the first installation hole. The air joint is installed on one side of the air circuit block, and the upper end of the suction rod is clamped to the Inside the fixed block, the lower end of the suction rod passes through the first installation hole and is fixedly connected to the upper end of the suction head. The lower end of the suction head passes through the base and the cover plate in turn and then contacts and connects to the chip. The two ends of the base are respectively fixedly connected to the air circuit. The lower end of the block and the upper end of the cover plate. The high-precision alignment and follow-up self-adaptive floating suction head described in the present invention can prevent the movement of the device from impacting the chip during the suction process, and has high positioning accuracy, and the structure of the device is compatible with a wide range of chips and satisfies large Stress test, strong adaptive compatibility.

Description

technical field [0001] The invention belongs to the field of IC test equipment, and in particular relates to a high-precision alignment and self-adaptive floating suction head. Background technique [0002] At present, the vigorous packaging and testing market demand puts forward new requirements for the equipment of packaging and testing companies, which can meet the testing needs of micro chips and high-density pins. However, the existing packaging and testing equipment is difficult to meet the testing requirements of tiny chips and high-density pins. The main reason is that the old packaging and testing equipment has poor automatic performance, and generally uses manual or semi-automatic devices, which are difficult to meet the needs of high precision, automation, high pressure, and wide variety. Existing mechanisms use pins, auxiliary rails, etc. to complete. These methods are prone to parts wear, large assembly errors, small degrees of freedom of parts, and certain li...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B25B11/00
CPCB25B11/005
Inventor 杨文宝崔学峰仇葳贺怀珍吕克振孟飞沈程
Owner 天津金海通半导体设备股份有限公司