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Capless semiconductor package with a micro-electromechanical system (MEMS)

A micro-electromechanical system and encapsulation technology, which is applied to TV system components, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of increased manufacturing steps and increased costs

Pending Publication Date: 2021-06-18
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cost of manufacturing a semiconductor package with a MEMS die increases and the number of manufacturing steps increases due to the increased number of components and materials used for the semiconductor package

Method used

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  • Capless semiconductor package with a micro-electromechanical system (MEMS)
  • Capless semiconductor package with a micro-electromechanical system (MEMS)
  • Capless semiconductor package with a micro-electromechanical system (MEMS)

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Embodiment Construction

[0021] In the following description, certain specific details are set forth in order to provide a thorough understanding of various embodiments of the present disclosure. However, it will be apparent to those skilled in the art that the present disclosure may be practiced without these specific details. In other instances, well-known structures associated with electronic components and semiconductor fabrication techniques have not been described in detail to avoid unnecessarily obscuring the description of embodiments of the present disclosure.

[0022] Unless the context otherwise requires, throughout this specification and the claims that follow, the word "comprising" and variations thereof (such as "comprising" and "comprising") should be interpreted in an open, inclusive sense, that is, to interpret "including but not limited to".

[0023] The use of ordinal numbers such as first, second, and third does not necessarily imply an ordering, but may merely distinguish multipl...

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Abstract

The embodiment of the invention relates to a capless semiconductor package with a micro-electromechanical system (MEMS). A semiconductor package that contains an application-specific integrated circuit (ASIC) die and a micro-electromechanical system (MEMS) die. The MEMS die and the ASIC die are coupled to a substrate that includes an opening that extends through the substrate and is in fluid communication with an air cavity positioned between and separating the MEMS die from the substrate. The opening exposes the air cavity to an external environment and, following this, the air cavity exposes a MEMS element of the MEMS die to the external environment. The air cavity separating the MEMS die from the substrate is formed with a method of manufacturing that utilizes a thermally decomposable die attach material.

Description

technical field [0001] The present disclosure relates to microelectromechanical systems (MEMS) sensors that are exposed to the external environment. Background technique [0002] Many semiconductor packages with microelectromechanical systems (MEMS) dies include cavities that expose the sensor components of the MEMS die to the external environment. The sensor assembly monitors the physical quantity or quality of the external environment outside the package. Such semiconductor packages are typically formed using rigid caps that are bonded to the substrate on which the MEMS die is positioned. The cap is shaped to form a cavity between the MEMS die and the cap, and includes an opening or hole that exposes the cavity to the external environment. The opening and cavity expose the sensor components of the MEMS die to the external environment. For example, the sensor assembly may monitor the external environment to which the sensor assembly is exposed: pressure, temperature, sou...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81B7/02B81C1/00
CPCB81B7/0032B81B7/02B81C1/00261B81C2203/0154B81B2203/0315B81B2201/0257B81B2201/0264B81C1/00309B81B2201/0278B81C2201/0108B81B7/0061B81B2207/07B81B2207/012B81C2201/0143B81C2201/0146
Inventor J·S·塔利多
Owner STMICROELECTRONICS SRL