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Material scheduling method and device for semiconductor processing equipment

A technology of processing equipment and scheduling method, which is applied in semiconductor/solid-state device manufacturing, transportation and packaging, conveyor objects, etc., can solve the problems of reducing equipment production capacity, resource waste, and inability to guarantee the global optimal scheduling results, and achieve improved computing speed effect

Active Publication Date: 2021-06-18
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since this method is not a global search, it can only obtain a local optimal scheduling result, which cannot be guaranteed to be the global optimal scheduling result. In some cases, it may cause waste of resources and reduce equipment productivity.

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  • Material scheduling method and device for semiconductor processing equipment
  • Material scheduling method and device for semiconductor processing equipment
  • Material scheduling method and device for semiconductor processing equipment

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Embodiment Construction

[0060] In order for those skilled in the art to better understand the technical solution of the present invention, the material scheduling method and device for semiconductor processing equipment provided by the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0061] Semiconductor processing equipment is used to process materials such as wafers to figure 1 with figure 2 The semiconductor processing equipment used in the glue removal process is shown as an example. The semiconductor processing equipment is a cluster type equipment. Specifically, the equipment mainly includes a transmission chamber 1 and three process chambers (21, 22, 23 ), a loading and unloading chamber (Load Lock) 3, a transition chamber 4 and three loading and unloading positions (51, 52, 53).

[0062] Among them, three process chambers (21, 22, 23) surround the transfer chamber 1 and are used to process materials. Each process chamber i...

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Abstract

The embodiment of the invention provides a material scheduling method and device for semiconductor processing equipment. The method comprises the following steps: S1, establishing a material list; s2, establishing a first scheduling task list according to the process formula and the material list; and S3, inputting the first scheduling task list into the solver, calculating and outputting an optimal scheduling result with the shortest time for executing all the material scheduling tasks in the first scheduling task list by utilizing the solver, and analyzing the optimal scheduling result to obtain a moving sequence of all the materials. According to the technical scheme of the material scheduling method and device for the semiconductor processing equipment provided by the embodiment of the invention, not only can a global optimal scheduling result be obtained, but also the calculation speed can be improved, so that the optimal scheduling result can be obtained in real time.

Description

technical field [0001] The present invention relates to the field of semiconductor manufacturing, in particular to a material scheduling method and device for semiconductor processing equipment. Background technique [0002] In the process of using semiconductor processing equipment to process multiple materials (such as wafers), it is necessary to transfer each material from the loading and unloading station to the process chamber according to the specified path for processing, and return to the loading and unloading station after the processing is completed. And at the same time, there will be a need for multiple materials to be dispatched at the same time. [0003] In order to realize the optimization of material scheduling, the existing material scheduling method is an enumeration method based on search tree, specifically according to the set material transmission path and the parameters of each component in the equipment (for example, the manipulator transfer time), Ex...

Claims

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Application Information

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IPC IPC(8): G05B19/418H01L21/67H01L21/677
CPCG05B19/41865H01L21/67276H01L21/67739G05B2219/32252Y02P90/02
Inventor 崔琳史思雪刘慕雅
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD