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Thin material forming device and method

A thin material and molding device technology, applied in the field of material manufacturing, can solve the problems of high price, difficult to change shape, long cycle, etc., and achieve the effect of improving molding quality

Pending Publication Date: 2021-06-22
上海足适智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional mold manufacturing has the characteristics of long period, high price, and the shape is difficult to change after the mold is manufactured.

Method used

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  • Thin material forming device and method
  • Thin material forming device and method
  • Thin material forming device and method

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Experimental program
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Embodiment Construction

[0042] The plurality of preferred embodiments of the present application are described below, and the technical content is clearer and easy to understand. The present application can be embodied in many different forms of embodiments, and the scope of protection of the present application is not limited to the embodiments mentioned in the article.

[0043] Various specific embodiments of the present application will be described below with reference to the accompanying drawings. It should be understood that although the terms representing the direction in the present application, such as "front", "post", "upper", "left", "right", "inside", "outside", " Top "," bottom "," positive "," counter "," far "," horizontal "," portrait "," width direction "," length direction "," high direction "," axial " , "Radial", "clockwise", "counterclockwise", etc. describe the various example structural parts and components of the present application, but these terms here are only for convenience o...

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PUM

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Abstract

The invention discloses a thin material forming device and method and relates to the field of material manufacturing. A pressure cavity of the thin material forming device is located between a prepreg cavity and a pressure cavity pressure plate, the prepreg cavity is of a hollow structure and communicates with the outside through a prepreg cavity pipeline, and a prepreg assembly is placed in the prepreg cavity; the pressure cavity is of a hollow structure and communicates with the outside through a pressure cavity pipeline, the pressure cavity is filled with filler through the pressure cavity pipeline so that the pressure cavity can be expanded to make contact with the pressure cavity pressure plate, and when the pressure cavity is expanded to press and make contact with the soft prepreg cavity, the prepreg assembly and the forming surface of a mold can be tightly pressed. The pressure cavity pressure plate is used for providing counter-acting force; and the prepreg cavity is vacuumized to facilitate molding or curing. According to the thin material forming device and method, the pressure cavity can automatically adapt to the curved surface form of the forming surface, a thin material is continuously and uniformly pressed, the pressure is controllable, and the forming quality is improved.

Description

Technical field [0001] The present application relates to the field of material manufacturing, and more particularly to a thin material molding apparatus and method. Background technique [0002] The composite material refers to a material which is combined with two or more different substances, which can exert the advantages of various materials, overcome the defects of a single material, and expand the application range of the material. Since the composite material has the characteristics of light weight, high strength, processing molding, good elasticity, chemical corrosion and weather resistance, has gradually replaced wood and metal alloys, widely used in aerospace, automotive, electronics, architecture, fitness equipment In the field, it has been developed in recent years. [0003] Modern high-tech development is inseparable from composite materials, and composite materials have a very important role in the development of modern science and technology. The research depth an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C70/44B29C33/42
CPCB29C33/42B29C70/44B29C2791/006
Inventor 康利平
Owner 上海足适智能科技有限公司