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Electrostatic chuck with charge dissipation coating

An electrostatic chuck and coating technology, applied in the direction of holding devices, circuits, and manufacturing tools that apply electrostatic attraction, can solve problems such as damage to sharp edges and limited utility

Pending Publication Date: 2021-06-29
ENTEGRIS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

The technical effect of this patented technology can include different ways for creators or users to communicate with each others about their products they want from them through an online platform that allows people who don't have access rights like yours to see what it works well without being restricted by its own designation.

Problems solved by technology

The technical problem addressed in this patented text relating to controlling charging buildups in an electric holding device called ESCU's involves improving their ability to prevent charged particles from attaching themselves onto surfaces like electronic components without damaging them.

Method used

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  • Electrostatic chuck with charge dissipation coating
  • Electrostatic chuck with charge dissipation coating
  • Electrostatic chuck with charge dissipation coating

Examples

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Embodiment Construction

[0016] Various example implementations of novel wafer substrate unchucking structures that provide electrostatic chucks and methods for using this configuration to reduce charge buildup that cause wafer substrates to "stick" after the electrostatic chuck has been powered down are described below. example. Localized surface charges can lead to unintended wafer clamping even in the absence of an external voltage. Therefore, there is also a need for improved platen or chuck configurations that control charge buildup in electrostatic chucks.

[0017] Referring now to the figures, figure 1 and 2 are top and exploded views, respectively, of an electrostatic chuck 100 designed to reduce wafer substrate "sticking" (increased from The difficulty with which the electrostatic chuck removes the wafer substrate) in order to "unclamp" or unclamp the wafer substrate from the electrostatic chuck after wafer substrate processing. Embodiments disclosed herein provide a conductive path on ra...

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Abstract

An electrostatic chuck solves the problem of wafer sticking by providing conductive paths on raised embossments that are bridged together and are connected to ground that support the wafer substrate above the surface of the electrostatic chuck. Further, laterally spaced electrode patterns and electrode elements which are spaced laterally and longitudinally away from the raised embossments reduce or eliminate electrical coupling during wafer clamping between conductively coated embossments and the electrode elements, thereby creating a low resistance path for charges remaining on the wafer after declamping to promptly travel to ground. The conductive bridge and electrode pattern configuration also substantially reduces or eliminates any charge build up on the conductive bridge(s) during clamping in order that charge build up in "islands" (worn portions of the insulator layer of the main field area) do not affect the charge dissipation from the wafer substrate through the conductive bridges to ground.

Description

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Claims

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Application Information

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Owner ENTEGRIS INC
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