Warpage correction method, bearing device and bearing system
A calibration method and a technology of a carrying device, applied in the field of inspection, can solve problems such as wafer warping, affecting wafer inspection accuracy, pressing, etc.
Pending Publication Date: 2021-07-06
SKYVERSE TECH CO LTD
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Problems solved by technology
[0002] During the wafer preparation process, the wafer is often warped due to the internal stress of the wafer, and when the warped wafer is inspected, the degree of warpage of the wafer will affect the inspection accuracy of the wafer , the existing warpage correction device mainly presses the warped wafer through the whole pressing plate, so that the warped wafer is flattened as a whole, but the warped part of the wafer may not be completely flattened due to different shapes of the pressing plate. Flattening, and the specific position cannot be pressed individually, thus affecting the inspection accuracy of the wafer
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[0045] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiment of the application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the application. Obviously, the described embodiment is only It is an embodiment of a part of the application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.
[0046] Each will be described in detail below.
[0047] The terms "first", "second", "third" and "fourth" in the specification and claims of the present application and the drawings are used to distinguish different objects, rather than to describe a specific order . Furthermore, the terms "include" and "have", as well as any variations thereof, are ...
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The invention discloses a warping correction method, a bearing device and a bearing system. The method comprises: the bearing device obtaining a first distance between an adsorption surface of an adsorption part and a to-be-tested part; when a first distance between the adsorption surface of the adsorption part and the to-be-detected part is greater than a first preset distance and is less than or equal to a second preset distance, determining that the adsorption part is a first target adsorption part, and the second preset distance is greater than the first preset distance; controlling the driving device to drive the first target adsorption piece to move towards the to-be-tested piece; when the first distance is smaller than or equal to the first preset distance, controlling the first target adsorption part to adsorb the to-be-tested part; and controlling the driving device to drive the adsorption member to move in a direction away from the to-be-tested member until the bottom of the first target adsorption member abuts against the bottom of the accommodating groove. The to-be-detected pieces in different areas are adsorbed through the adsorption pieces distributed at different positions on the bearing body, so that the different areas of the to-be-detected pieces can be flattened in a vacuum adsorption mode, and the detection precision of the to-be-detected pieces is improved.
Description
technical field [0001] The present application relates to the technical field of detection, and in particular to a warpage correction method, a carrying device and a carrying system. Background technique [0002] During the wafer preparation process, the wafer is often warped due to the internal stress of the wafer, and when the warped wafer is inspected, the degree of warpage of the wafer will affect the inspection accuracy of the wafer , the existing warpage correction device mainly presses the warped wafer through the whole pressing plate, so that the warped wafer is flattened as a whole, but the warped part of the wafer may not be completely flattened due to different shapes of the pressing plate. Flattening, and the specific position cannot be pressed individually, thus affecting the inspection accuracy of the wafer. Contents of the invention [0003] Embodiments of the present application provide a warpage correction method, a carrying device, and a carrying system....
Claims
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IPC IPC(8): H01L21/683H01L21/66
CPCH01L22/12H01L21/6838
Inventor 陈鲁李少雷张朝前马砚忠卢继奎张嵩
Owner SKYVERSE TECH CO LTD