Check patentability & draft patents in minutes with Patsnap Eureka AI!

Levelness measuring device and levelness adjusting method

A technology of level measurement and adjustment method, which is applied in the directions of measuring device, measuring inclination, surveying and navigation, etc., and can solve problems affecting process continuity and poor measurement accuracy.

Pending Publication Date: 2021-07-09
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention discloses a levelness measuring device and a levelness adjustment method to solve the problem that the measurement accuracy of the relative levelness between the measured object such as the base and the reference object such as the preheating ring is poor and affects the continuity of the process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Levelness measuring device and levelness adjusting method
  • Levelness measuring device and levelness adjusting method
  • Levelness measuring device and levelness adjusting method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] The technical solutions disclosed by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0032] Such as Figure 2-Figure 9 As shown, the embodiment of the present invention discloses a levelness measuring device, and the levelness between the measured object 710 and the reference o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a levelness measuring device and a levelness adjusting method. The levelness measuring device is used for measuring the levelness between a measured object and a reference object in semiconductor equipment. The measured object and the reference object are both arranged in a reaction chamber enclosed by a transparent cover and a reaction chamber. The levelness measuring device comprises a mounting piece, a connecting piece and a distance measuring sensor, the mounting piece can be arranged on the semiconductor equipment, and the distance measuring sensor is movably mounted on the mounting piece through the connecting piece. The distance measuring sensor can measure first distances between a plurality of preset positions on the measured object and corresponding positions on the reference object in the axial direction of the reference object through the transparent cover, and the first distances are used for measuring the levelness between the measured object and the reference object. According to the technical scheme, the problems that the measurement precision of the relative levelness between the measured object such as the base and the reference object such as the preheating ring is poor and the process continuity is influenced can be solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a levelness measuring device and a levelness adjustment method. Background technique [0002] The epitaxy process is a common process in the semiconductor processing process. The process gas is passed into the reaction chamber through the gas inlet hole, and the process gas passes through the surface of the substrate, so that the growth atoms can be deposited on the substrate and a single crystal layer can be grown. . In the epitaxial process, the substrate is usually placed on the susceptor, and the preheating ring set outside the susceptor can heat the susceptor, and the relative level between the susceptor and the preheating ring will affect the temperature on the susceptor. The temperature distribution, in the case of poor levelness, will have an adverse effect on the thickness consistency of the epitaxial layer due to the different temperatures at different...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01C9/00
CPCG01C9/00
Inventor 王欢
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More