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Rigid-flex board pressing method

A technology of soft-rigid combination board and pressing temperature, which is applied in the direction of electrical connection formation of printed components, multi-layer circuit manufacturing, electrical components, etc., and can solve problems such as gold fingers that cannot meet the size requirements, finger layer size control changes, etc.

Active Publication Date: 2021-07-09
FOREWIN FPC SUZHOU
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, the CPK value can only determine the size of the finger layer, but cannot control and change the size of the finger layer. That is to say, it cannot fundamentally solve the problem of controlling the size of the finger layer of the circuit board, and ultimately cannot be satisfied Cheats for Size Conditions

Method used

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  • Rigid-flex board pressing method

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "bottom", "inner" and "outer" are based on the orientation or positional relationship shown in the drawings , is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the referred device or element must have a specific orientatio...

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Abstract

The invention discloses a rigid-flex board pressing method, which comprises the steps of measuring the size of a finger layer after the finger layer is manufactured, calculating a first CPK value of the finger layer according to a first actual size of the finger layer and a preset size of the finger layer, judging whether the first CPK value is greater than a first preset value or not, if the first CPK value is not larger than the first preset value, comparing the first actual size with the preset size, and if the first actual size is smaller than the preset size, attaching a silica gel pad to the pressing surface of a flat pressing machine to press the circuit board in the subsequent pressing process of the circuit board, and if the first actual size is greater than the preset size, attaching a glass fabric to the pressing surface of the flat pressing machine to press the circuit board in the subsequent pressing process of the circuit board. Due to the fact that the silica gel pad can extend the finger layer, and the glass fabric can restrict the finger layer, the size of the finger layer can be restricted within a reasonable error range, and the percent of pass is improved.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a pressing method for a rigid-flex board. Background technique [0002] The connecting finger is the connecting part between the memory stick and the memory slot, and all signals are transmitted through the connecting finger. Gold fingers are composed of many golden-yellow conductive contacts. Because the surface is gold-plated and the conductive contacts are arranged like fingers, they are called "gold fingers". [0003] For flex-rigid boards, the golden finger is usually set on the soft board layer, and the inner double-sided boards are laminated to form a circuit board. The size control of the gold finger layer of the finished circuit board is extremely strict, and the tolerance of the gold finger layer is also relatively strict. However, because the lamination process is high temperature and high pressure, the size of the finger layer will change when the board passes...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40H05K3/46
CPCH05K3/403H05K3/4691H05K2203/068H05K2203/163
Inventor 皇甫铭张健
Owner FOREWIN FPC SUZHOU
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