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Cleaning disc structure of single wafer cleaning device and single wafer cleaning device

A technology for cleaning devices and disks, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., to achieve the effect of preventing interference

Active Publication Date: 2021-07-13
JIANGSU ASIA ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: in order to solve the deficiencies in the prior art, thereby providing a single-chip Wafer Cleaning Device Cleaning Plate Structure and Single Wafer Cleaning Device

Method used

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  • Cleaning disc structure of single wafer cleaning device and single wafer cleaning device
  • Cleaning disc structure of single wafer cleaning device and single wafer cleaning device
  • Cleaning disc structure of single wafer cleaning device and single wafer cleaning device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] This embodiment provides a single wafer cleaning device cleaning plate structure, such as figure 2 shown, including:

[0058] The support plate 2 can rotate and is used to support and fix the wafer. The bottom of the support plate 2 is connected to the rotating shaft 25, and the rotating shaft 25 is driven by the motor 7 to rotate, thereby causing the support plate 2 to rotate. There is a space in the middle of the support plate 2. cavity 24, the middle of the rotating shaft 25 is a passage, and the passage can pass through the heated nitrogen gas. There are a number of wafer support columns 21 on the disk surface of the support disk 2. There are also passages on the disk surface of the support disk 2. Hole 22, the heated nitrogen gas is ejected from the passage in the middle of the rotating shaft 25 through the cavity 24 from the through hole 22 to heat the wafer and form an air flow at the bottom of the wafer to prevent the cleaning liquid from flowing into the botto...

Embodiment 2

[0071] This embodiment provides a single wafer cleaning device, such as figure 1 shown, including:

[0072] Shell 1 and the structure of the cleaning disc of the single wafer cleaning device inside the shell 1;

[0073] The interior of the housing 1 is divided into several areas by partitions, wherein the horizontal partition divides the interior of the housing 1 into upper and lower parts, and the vertical partition divides the interior of the housing 1 into left and right parts, forming four parts in total. One of the areas is a cleaning area, which is used to set the following components; the housing 1 is also provided with a door for inserting or taking out wafers. Of course, the casing 1 is also provided with an exhaust device to extract some gases inside the casing 1, such as some toxic and harmful gases that are easily volatilized in the cleaning liquid. These toxic and harmful gases cannot be discharged at will and need to be treated. It is relatively common in this ...

Embodiment 3

[0076] This embodiment provides a method for cleaning a single wafer, using the device for cleaning a single wafer in Embodiment 2, comprising the following steps:

[0077] S1: Place the wafer on the support plate 2 with the cleaning surface facing up, make the support plate 2 drive the wafer to rotate, pass the heated nitrogen gas into the cavity 24 of the support plate 2 from the channel in the middle of the rotating shaft 25 and Eject from the through hole 22 on the top of the support plate 2 to heat the wafer and heat the wafer;

[0078] S2: Swing a number of cleaning liquid spray pipes 3 aligned above the center of the wafer, spray the cleaning liquid onto the wafer through the cleaning liquid spray pipes 3, and make the cleaning liquid spray pipes 3 align with the wafer Swing from above the center of the circle to above the edge of the aligned wafer, so that the cleaning liquid reaches the entire surface of the wafer;

[0079] S3: After cleaning for a period of time, st...

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PUM

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Abstract

The invention relates to a cleaning disc structure of a single wafer cleaning device, a wafer faces upwards and is cleaned by a cleaning fluid sprayed by a cleaning fluid spray pipe, clear water is sprayed by a clear water spray pipe to remove cleaning agent residues on the wafer, and when the cleaning fluid spray pipe and the clear water spray pipe are used, the cleaning fluid spray pipe and the clear water spray pipe are rotated to correspondingly reach the upper part of the wafer, the cleaning liquid spraying pipes and the clean water spraying pipes are moved away to prevent interference when not used, the multiple parallel cleaning liquid spraying pipes can spray different types of cleaning liquid, and multiple purposes of one machine are achieved. Meanwhile, the heated nitrogen is sprayed out of the through holes through the cavity from the channel in the middle of the rotating shaft, and air flow is formed at the bottom of the wafer to prevent the cleaning liquid from flowing into the bottom face of the wafer while the wafer is heated.

Description

technical field [0001] The present application belongs to the technical field of wafer cleaning equipment, and in particular relates to a cleaning plate structure of a single wafer cleaning device and a single wafer cleaning device. Background technique [0002] In the existing semiconductor process, when performing high-dose ion implantation on the semiconductor substrate, it is necessary to form a photoresist layer with a certain pattern on the surface of the semiconductor substrate, and then perform ion implantation on the semiconductor substrate according to the patterned photoresist layer. implanted to form shallow trench isolation structures on the wafer. After the ion implantation is completed, the wafer needs to be cleaned by wet cleaning to remove the photoresist and particle defects on the surface of the wafer. [0003] For example, the Chinese patent document CN108649008A discloses a single-chip cleaning device and method for cleaning wafers after ion implantatio...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67051H01L21/67034
Inventor 钱诚李文亭朱震
Owner JIANGSU ASIA ELECTRONICS TECH CO LTD
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